DSPIC33EP256MU806-E/MR Microchip Technology, DSPIC33EP256MU806-E/MR Datasheet - Page 556

• Manufacturer Part Number: DSPIC33EP256MU806-E/MR
• Description: 64 PINS, 256KB Flash, 28KB RAM, 60 MHz, USB, 2xCAN, 15 DMA 64 QFN 9x9x0.9mm TUBE
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33EPr

Specifications of DSPIC33EP256MU806-E/MR

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, QEI, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 256KB (85.5K x 24)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 12K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 24x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-VFQFN Exposed Pad
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33EPXXXMU806/810/814 and PIC24EPXXXGU810/814
TABLE A-2:
DS70616E-page 556
Section 21.0 “Enhanced CAN
(ECAN™) Module”
Section 22.0 “USB On-The-Go
(OTG) Module”
Section 23.0 “10-bit/12-bit
Analog-to-Digital Converter
(ADC)”
Section 29.0 “Special Features”
Section 30.0 “Instruction Set
Summary”
Section 32.0 “Electrical
Characteristics”
Section Name
MAJOR SECTION UPDATES (CONTINUED)
Added the CANCKS bit to the ECAN Control Register 1 (CiCTRL1)
(see Register 21-1).
Removed the USB 3.3V Regulator logic from the USB Interface Diagram
(see Figure 22-1).
Updated the ADC Conversion Clock Period Block Diagram (see Figure 23-2).
Updated the last paragraph of Section 29.1 “Configuration Bits”
Added a note box after the last paragraph of Section 29.3 “BOR: Brown-out
Reset (BOR)”.
Added the RTSP Effect column to the Configuration Bits Description
(see Table 29-2).
Updated all Status Flags Affected to None for the MOV instruction and added
Note 2 (see Table 30-2).
Updated the Absolute Maximum Ratings (see page 457).
Added Note 1 to the Operating MIPS vs. Voltage (see Table 32-1).
Added parameter DI31 (I
Table 32-9).
Updated the Minimum value for parameter DO26 in the I/O Pin Output
Specifications (see Table 32-10).
Updated the Minimum value for parameter D132b and the Minimum and
Maximum values for parameters D136a, D136b, D137a, D137b, D138a, and
D138b in the Program Memory specification (see Table 32-12).
Updated the Minimum, Typical, and Maximum values for parameter OS10
(Oscillator Crystal Frequency: S
Requirements (see Table 32-16).
Added Note 2 to the PLL Clock Timing Specifications (see Table 32-17).
Updated all Timer1 External Clock Timing Requirements (see Table 32-23).
Replaced Table 32-34 with Timer2, Timer4, Timer6, Timer8 External Clock
Timing Requirements and Timer3, Timer5, Timer7, Timer9 External Clock
Timing Requirements (see Table 32-24 and Table 32-25, respectively).
Updated the Maximum value for parameter OC15 and the Minimum value for
parameter OC20 in the OC/PWM Mode Timing Requirements
(see Table 32-29).
Updated the Operating Temperature in the ECAN Module I/O Timing
Requirements and USB OTG Timing Requirements (see Table 32-51 and
Table 32-53, respectively).
Updated all SPI specifications (see Figure 32-15 through Figure 32-30 and
Table 32-33 through Table 32-48).
Removed Note 4 from the DCI Module Timing Requirements
(see Table 32-59).
Updated the Standard Operating Conditions voltage for the Comparator
Specifications (see Table 32-61 through Table 32-64).
Preliminary
CNPD
Update Description
) to the I/O Pin Input Specifications (see
OSC
) in the External Clock Timing
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