DSPIC33EP256MU806-E/MR Microchip Technology, DSPIC33EP256MU806-E/MR Datasheet - Page 498

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DSPIC33EP256MU806-E/MR

Manufacturer Part Number
DSPIC33EP256MU806-E/MR
Description
64 PINS, 256KB Flash, 28KB RAM, 60 MHz, USB, 2xCAN, 15 DMA 64 QFN 9x9x0.9mm TUBE
Manufacturer
Microchip Technology
Series
dsPIC™ 33EPr
Datasheet

Specifications of DSPIC33EP256MU806-E/MR

Core Processor
dsPIC
Core Size
16-Bit
Speed
60 MIPs
Connectivity
CAN, I²C, IrDA, LIN, QEI, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
51
Program Memory Size
256KB (85.5K x 24)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
12K x 16
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 24x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-VFQFN Exposed Pad
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
dsPIC33EPXXXMU806/810/814 and PIC24EPXXXGU810/814
TABLE 32-41: SPI2 MAXIMUM DATA/CLOCK RATE SUMMARY
FIGURE 32-23:
DS70616E-page 498
AC CHARACTERISTICS
Maximum
Data Rate
15 MHz
10 MHz
10 MHz
15 MHz
15 MHz
11 MHz
11 MHz
Note: Refer to
(CKP = 0)
(CKP = 1)
SCK2
SCKx
SDOx
Transmit Only
(Half-Duplex)
Table 32-42
Figure 32-1
Master
SPI2 MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY CKE = 0) TIMING
CHARACTERISTICS
SP30, SP31
for load conditions.
SP35
Transmit/Receive
SP10
(Full-Duplex)
Table 32-43
Table 32-44
MSb
Master
Preliminary
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Transmit/Receive
Bit 14 - - - - - -1
(Full-Duplex)
Table 32-45
Table 32-46
Table 32-47
Table 32-48
Slave
SP21
SP20
SP30, SP31
SP20
SP21
LSb
CKE
0,1
-40°C  T
-40°C  T
 2009-2011 Microchip Technology Inc.
1
0
1
1
0
0
A
A
 +85°C for Industrial
 +125°C for Extended
CKP
0,1
0,1
0,1
0
1
1
0
SMP
0,1
1
1
0
0
0
0

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