DSPIC33EP256MU806-E/MR Microchip Technology, DSPIC33EP256MU806-E/MR Datasheet - Page 480

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DSPIC33EP256MU806-E/MR

Manufacturer Part Number
DSPIC33EP256MU806-E/MR
Description
64 PINS, 256KB Flash, 28KB RAM, 60 MHz, USB, 2xCAN, 15 DMA 64 QFN 9x9x0.9mm TUBE
Manufacturer
Microchip Technology
Series
dsPIC™ 33EPr
Datasheet

Specifications of DSPIC33EP256MU806-E/MR

Core Processor
dsPIC
Core Size
16-Bit
Speed
60 MIPs
Connectivity
CAN, I²C, IrDA, LIN, QEI, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
51
Program Memory Size
256KB (85.5K x 24)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
12K x 16
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 24x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-VFQFN Exposed Pad
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
dsPIC33EPXXXMU806/810/814 and PIC24EPXXXGU810/814
FIGURE 32-7:
TABLE 32-26: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS
DS70616E-page 480
AC CHARACTERISTICS
Param.
TQ10
TQ11
TQ15
TQ20
Note 1:
TtQH
TtQL
TtQP
T
POSCNT
QEB
CKEXTMRL
Symbol
These parameters are characterized but not tested in manufacturing.
TIMERQ (QEI MODULE) EXTERNAL CLOCK TIMING CHARACTERISTICS
TQCK High Time Synchronous,
TQCK Low Time Synchronous,
TQCP Input
Period
Delay from External TxCK Clock
Edge to Timer Increment
Characteristic
with prescaler
with prescaler
Synchronous,
with prescaler
(1)
TQ10
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Preliminary
TQ15
[Greater of
0.5 T
[Greater of
0.5 T
[Greater of
(25 or T
/N] + 50
(12.5 or
(12.5 or
Min.
+ 25
+ 25
CY
CY
)/N]
)/N]
CY
TQ11
)
Typ.
-40°C  T
-40°C  T
1
 2009-2011 Microchip Technology Inc.
Max.
T
CY
A
A
 +85°C for Industrial
 +125°C for Extended
TQ20
Units
ns
ns
ns
Must also meet
parameter TQ15.
Must also meet
parameter TQ15.
Conditions

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