HD64F3048BF25 Renesas Electronics America, HD64F3048BF25 Datasheet - Page 688
![IC H8 MCU FLASH 128K 100QFP](/photos/12/21/122166/qfp100-g1_pkg_sml.jpg)
HD64F3048BF25
Manufacturer Part Number
HD64F3048BF25
Description
IC H8 MCU FLASH 128K 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.DF3048BF25V.pdf
(903 pages)
Specifications of HD64F3048BF25
Core Processor
H8/300H
Core Size
16-Bit
Speed
8MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3048BF25
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
HD64F3048BF25V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
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Section 21 Electrical Characteristics
Item
Input pull-up
MOS current
Input
capacitance
Current
dissipation *
Analog
power
supply
current
Reference
current
RAM standby voltage
Notes: 1. If the A/D and D/A converters are not used, do not leave the AV
Rev. 3.00 Sep 27, 2006 page 660 of 872
REJ09B0325-0300
2. Current dissipation values are for V
3. The values are for V
4. Module standby current values apply in sleep mode with all modules halted.
5. The current dissipation value for flash memory program/erase operations (T
6. I
I
open. Connect AV
output pins unloaded and the on-chip pull-up transistors in the off state.
+75°C) is 10 mA (max.) greater than the current dissipation value for normal operation.
I
I
V
The typical values of current dissipation are reference values.
2
CC
CC
CC
CC
CC
max. (normal operation) = 6.0 [mA] + 0.60 [mA/(MHz
Ports 2, 4,
and 5
FWE
NMI
All input pins
except NMI,
FWE
Normal
operation *
Sleep mode
Module standby
mode *
Standby mode *
During A/D
conversion
During A/D and
D/A conversion
Idle
During A/D
conversion
During A/D and
D/A conversion
Idle
depends on V
max. (sleep mode) = 6.0 [mA] + 0.49 [mA/(MHz
max. (sleep mode and module standby mode) = 6.0 [mA] + 0.21 [mA/(MHz
f
4
5
CC
CC
3
and f, according to the following expressions.
Symbol
–I
C
I
AI
AI
V
RAM
and V
CC
RAM
in
P
CC
CC
*
6
V
REF
CC
< 3.0 V, V
to V
Min
10
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2.0
CC
, and connect AV
IH
min = V
IH
min = V
Typ
—
—
—
—
40
30
20
1
—
0.5
0.5
0.01
0.4
1.5
0.01
—
CC
–0.5 V and V
CC
SS
Max
300
60
50
15
60
50
25
10
80
1.5
1.5
5
0.8
3
5
—
0.9, and V
V)]
to V
V)]
V
SS
CC
.
IL
max = 0.5 V with all
IL
V
CC
f
Unit Test Conditions
µA
pF
pF
pF
mA
mA
mA
µA
µA
mA
mA
µA
mA
mA
µA
V
max = 0.3 V.
CC
, AV
f
SS
V
V
f = fmin,
T
f = 25 MHz
T
50°C < T
AV
DASTE = 0
V
DASTE = 0
, and V
a
a
in
in
REF
= 25°C
= 0 V
= 0 V,
CC
= 3.3 V
50°C
= 3.3 V
a
= 0°C to
REF
a
V)]
pins
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