HD64F3048BF25 Renesas Electronics America, HD64F3048BF25 Datasheet - Page 652

• Manufacturer Part Number: HD64F3048BF25
• Description: IC H8 MCU FLASH 128K 100QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3048BF25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 8MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Rev. 3.00 Sep 27, 2006 page 624 of 872
REJ09B0325-0300
Notes: 1. In transition to the boot mode and transition from the boot mode to another mode, mode switching via RES
V
FWE
MD
RXD1 *
RES
SWE bit
CC
2
to MD
Flash memory access disabled time
(x: Wait time after SWE setting, y: wait time after SWE clearing)
Flash memory reprogammable period
(Flash memory program execution and data read, other than verify, are disabled.)
4
2. When making a transition from the boot mode to another mode, the mode programming setup time t
3. See section 21.1.6, Flash Memory Characteristics.
4. For pin RXD1, use on-board pull-up.
0
input is necessary.
During this switching period (period during which a low level is input to the RES pin),the state of the address
dual port and bus control output signals (CSn, AS, RD, WR) changes.
Therefore, do not use these pins as output signals during this switching period.
to the RES clear timing is necessary.
,
Mode switching *
(Example: Boot mode
t
OSC1
SWE set
t
MDS
t
MDS
1
Figure 18.20 Mode Transition Timing
Boot mode
SWE clear
Min 0 s
Mode
switching *
t
RESW
t
MDS
User mode
*
2
1
User
mode
*
3
User program mode
User program mode)
User
mode
User
program
mode
MDS
relative