DF2378BVFQ35WV Renesas Electronics America, DF2378BVFQ35WV Datasheet - Page 242

IC H8S/2378 MCU FLASH 144-QFP

DF2378BVFQ35WV

Manufacturer Part Number
DF2378BVFQ35WV
Description
IC H8S/2378 MCU FLASH 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2378BVFQ35WV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
35MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-QFP
For Use With
EDK2378 - DEV EVAL KIT FOR H8S/2378
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2378BVFQ35WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller (BSC)
6.4.3
Memory Interfaces
The memory interfaces in this LSI comprise a basic bus interface that allows direct connection of
ROM, SRAM, and so on; a DRAM interface that allows direct connection of DRAM; a
synchronous DRAM interface that allows direct connection of synchronous DRAM; and a burst
ROM interface that allows direct connection of burst ROM. The interface can be selected
independently for each area.
An area for which the basic bus interface is designated functions as normal space, an area for
which the DRAM interface is designated functions as DRAM space, an area for which the
synchronous DRAM interface is designated functions as continuous synchronous DRAM space,
and an area for which the burst ROM interface is designated functions as burst ROM space.
The initial state of each area is basic bus interface, 3-state access space. The initial bus width is
selected according to the operating mode.
Note: The synchronous DRAM interface is not supported by the H8S/2378 Group.
Area 0: Area 0 includes on-chip ROM in expanded mode with on-chip ROM enabled and the
space excluding on-chip ROM is external address space, and in expanded mode with on-chip
ROM disabled, all of area 0 is external address space.
When area 0 external space is accessed, the CS0 signal can be output.
Either basic bus interface or burst ROM interface can be selected for area 0.
Area 1: In externally expanded mode, all of area 1 is external address space.
When area 1 external address space is accessed, the CS1 signal can be output.
Either basic bus interface or burst ROM interface can be selected for area 1.
Areas 2 to 5: In externally expanded mode, areas 2 to 5 are all external address space.
When area 2 to 5 external space is accessed, signals CS2 to CS5 can be output.
Basic bus interface, DRAM interface, or synchronous DRAM interface can be selected for areas 2
to 5. With the DRAM interface, signals CS2 and CS5 are used as RAS signals.
If areas 2 to 5 are designated as continuous DRAM space, large-capacity (e.g. 64-Mbit) DRAM
can be connected. In this case, the CS2 signal is used as the RAS signal for the continuous DRAM
space.
Rev.7.00 Mar. 18, 2009 page 174 of 1136
REJ09B0109-0700

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