DF2398TE20V Renesas Electronics America, DF2398TE20V Datasheet - Page 1043
![IC H8S MCU FLASH 256K 120TQFP](/photos/12/21/122170/df2398te20v_sml.jpg)
DF2398TE20V
Manufacturer Part Number
DF2398TE20V
Description
IC H8S MCU FLASH 256K 120TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2398TE20V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
120-TQFP, 120-VQFP
For Use With
YR0K42378FC000BA - KIT EVAL FOR H8S/2378
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2398TE20V
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2398TE20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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F.1
(1) To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low at least 10 system clock
(2) To retain RAM contents with the RAME bit cleared to 0 in SYSCR, or when RAM contents do not need to be retained,
F.2
Drive the RES signal low and the NMI signal high approximately 100 ns or more before STBY goes high to execute a
power-on reset.
cycles before the STBY signal goes low, as shown below. RES must remain low until STBY signal goes low (delay
from STBY low to RES high: 0 ns or more).
RES does not have to be driven low as in (1).
Appendix F
Timing of Transition to Hardware Standby Mode
Timing of Recovery from Hardware Standby Mode
STBY
RES
STBY
RES
NMI
Figure F-2 Timing of Recovery from Hardware Standby Mode
Figure F-1 Timing of Transition to Hardware Standby Mode
Timing of Transition to and Recovery from Hardware
Standby Mode
t
1
10 t
t 100 ns
cyc
t
2
0 ns
t
OSC
Rev.6.00 Oct.28.2004 page 1013 of 1016
t
NMIRH
REJ09B0138-0600H
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