C8051F321-GM Silicon Laboratories Inc, C8051F321-GM Datasheet - Page 3

IC 8051 MCU 16K FLASH 28MLP

C8051F321-GM

Manufacturer Part Number
C8051F321-GM
Description
IC 8051 MCU 16K FLASH 28MLP
Manufacturer
Silicon Laboratories Inc
Series
C8051F32xr
Datasheets

Specifications of C8051F321-GM

Program Memory Type
FLASH
Program Memory Size
16KB (16K x 8)
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
21
Ram Size
2.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
2.25 KB
Interface Type
I2C/SMBus/SPI/UART/USB
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
21
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F320DK
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 10-bit or 17-ch x 10-bit
No. Of I/o's
21
Ram Memory Size
1280Byte
Cpu Speed
25MHz
No. Of Timers
4
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1480 - DAUGHTER CARD TOOLSTCK C8051F321770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1449 - ADAPTER PROGRAM TOOLSTICK F321336-1260 - DEV KIT FOR C8051F320/F321
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1261

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Manufacturer
Quantity
Price
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C8051F321-GM
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Manufacturer:
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Part Number:
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TABLE OF CONTENTS
1. SYSTEM OVERVIEW .........................................................................................................17
2. ABSOLUTE MAXIMUM RATINGS ..................................................................................29
3. GLOBAL DC ELECTRICAL CHARACTERISTICS ......................................................30
4. PINOUT AND PACKAGE DEFINITIONS........................................................................31
5. 10-BIT ADC (ADC0) .............................................................................................................39
6. VOLTAGE REFERENCE....................................................................................................55
7. COMPARATORS ................................................................................................................57
8. VOLTAGE REGULATOR (REG0) ....................................................................................67
9. CIP-51 MICROCONTROLLER .........................................................................................73
1.1. CIP-51™ Microcontroller Core ......................................................................................20
1.2. On-Chip Memory ............................................................................................................22
1.3. Universal Serial Bus Controller.......................................................................................23
1.4. Voltage Regulator............................................................................................................23
1.5. On-Chip Debug Circuitry ................................................................................................24
1.6. Programmable Digital I/O and Crossbar .........................................................................25
1.7. Serial Ports.......................................................................................................................25
1.8. Programmable Counter Array .........................................................................................26
1.9. 10-Bit Analog to Digital Converter.................................................................................27
1.10.Comparators ....................................................................................................................28
5.1. Analog Multiplexer .........................................................................................................40
5.2. Temperature Sensor.........................................................................................................41
5.3. Modes of Operation.........................................................................................................42
5.4. Programmable Window Detector ....................................................................................50
8.1. Regulator Mode Selection ...............................................................................................68
8.2. VBUS Detection..............................................................................................................69
9.1. Instruction Set..................................................................................................................75
9.2. Memory Organization .....................................................................................................79
1.1.1. Fully 8051 Compatible ..........................................................................................20
1.1.2. Improved Throughput ............................................................................................20
1.1.3. Additional Features................................................................................................21
5.3.1. Starting a Conversion.............................................................................................42
5.3.2. Tracking Modes .....................................................................................................43
5.3.3. Settling Time Requirements ..................................................................................44
5.4.1. Window Detector In Single-Ended Mode .............................................................52
5.4.2. Window Detector In Differential Mode.................................................................53
9.1.1. Instruction and CPU Timing..................................................................................75
9.1.2. MOVX Instruction and Program Memory.............................................................75
9.2.1. Program Memory ...................................................................................................79
9.2.2. Data Memory .........................................................................................................80
9.2.3. General Purpose Registers .....................................................................................80
9.2.4. Bit Addressable Locations .....................................................................................80
9.2.5. Stack ...................................................................................................................80
9.2.6. Special Function Registers.....................................................................................81
Rev. 1.1
C8051F320/1
3

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