PIC18F25J10-I/SS Microchip Technology, PIC18F25J10-I/SS Datasheet - Page 217

IC PIC MCU FLASH 16KX16 28SSOP

PIC18F25J10-I/SS

Manufacturer Part Number
PIC18F25J10-I/SS
Description
IC PIC MCU FLASH 16KX16 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F25J10-I/SS

Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
21
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Controller Family/series
PIC18
No. Of I/o's
21
Ram Memory Size
1KB
Cpu Speed
40MHz
No. Of Timers
3
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SPIC, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183022, DM183032, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Package
28SSOP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162074 - HEADER INTRFC MPLAB ICD2 44TQFPMA180011 - MODULE PLUG-IN 18F25J10 28SOICAC162067 - HEADER INTRFC MPLAB ICD2 40/28PAC164331 - MODULE SKT FOR 28SSOP 18F45J10XLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F25J10-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
tion time has elapsed, the A/D conversion can be
started. An acquisition time can be programmed to
occur between setting the GO/DONE bit and the actual
start of the conversion.
The following steps should be followed to do an A/D
conversion:
1.
2.
FIGURE 17-2:
© 2008 Microchip Technology Inc.
Configure the A/D module:
• Configure analog pins, voltage reference and
• Select A/D input channel (ADCON0)
• Select A/D acquisition time (ADCON2)
• Select A/D conversion clock (ADCON2)
• Turn on A/D module (ADCON0)
Configure A/D interrupt (if desired):
• Clear ADIF bit
• Set ADIE bit
• Set GIE bit
digital I/O (ADCON1)
Legend: C
V
AIN
R
S
V
I
R
SS
C
R
LEAKAGE
T
PIN
IC
HOLD
SS
ANALOG INPUT MODEL
ANx
C
5 pF
PIN
= Input Capacitance
= Threshold Voltage
= Leakage Current at the pin due to
= Interconnect Resistance
= Sampling Switch
= Sample/Hold Capacitance (from DAC)
= Sampling Switch Resistance
various junctions
V
DD
V
V
T
T
= 0.6V
= 0.6V
PIC18F45J10 FAMILY
I
±100 nA
LEAKAGE
3.
4.
5.
6.
7.
R
IC
Wait the required acquisition time (if required).
Start conversion:
• Set GO/DONE bit (ADCON0<1>)
Wait for A/D conversion to complete, by either:
• Polling for the GO/DONE bit to be cleared
OR
• Waiting for the A/D interrupt
Read A/D Result registers (ADRESH:ADRESL);
clear bit, ADIF, if required.
For next conversion, go to step 1 or step 2, as
required. The A/D conversion time per bit is
defined as T
required before next acquisition starts.
≤ 1k
SS
Sampling
Switch
V
DD
AD
R
SS
. A minimum wait of 2 T
Sampling Switch
1
V
SS
C
2
HOLD
3
DS39682D-page 215
= 25 pF
(kΩ)
4
AD
is

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