PIC18F25J10-I/SS Microchip Technology, PIC18F25J10-I/SS Datasheet - Page 176

IC PIC MCU FLASH 16KX16 28SSOP

PIC18F25J10-I/SS

Manufacturer Part Number
PIC18F25J10-I/SS
Description
IC PIC MCU FLASH 16KX16 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F25J10-I/SS

Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
21
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
Controller Family/series
PIC18
No. Of I/o's
21
Ram Memory Size
1KB
Cpu Speed
40MHz
No. Of Timers
3
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SPIC, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183022, DM183032, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Package
28SSOP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162074 - HEADER INTRFC MPLAB ICD2 44TQFPMA180011 - MODULE PLUG-IN 18F25J10 28SOICAC162067 - HEADER INTRFC MPLAB ICD2 40/28PAC164331 - MODULE SKT FOR 28SSOP 18F45J10XLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F25J10-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F45J10 FAMILY
15.4.7
In I
reload value is placed in the lower 7 bits of the
SSPxADD register (Figure 15-17). When a write
occurs to SSPxBUF, the Baud Rate Generator will
automatically begin counting. The BRG counts down to
‘0’ and stops until another reload has taken place. The
BRG count is decremented twice per instruction cycle
(T
BRG is reloaded automatically.
Once the given operation is complete (i.e., transmis-
sion of the last data bit is followed by ACK), the internal
clock will automatically stop counting and the SCLx pin
will remain in its last state.
FIGURE 15-17:
TABLE 15-3:
DS39682D-page 174
Note 1:
CY
2
C Master mode, the Baud Rate Generator (BRG)
) on the Q2 and Q4 clocks. In I
10 MHz
10 MHz
10 MHz
4 MHz
4 MHz
4 MHz
1 MHz
1 MHz
1 MHz
The I
100 kHz) in all details, but may be used with care where higher rates are required by the application.
BAUD RATE
F
CY
2
C™ interface does not conform to the 400 kHz I
I
2
C™ CLOCK RATE w/BRG
SSPM3:SSPM0
BAUD RATE GENERATOR BLOCK DIAGRAM
SCLx
2
C Master mode, the
SSPM3:SSPM0
20 MHz
20 MHz
20 MHz
F
8 MHz
8 MHz
8 MHz
2 MHz
2 MHz
2 MHz
CY
* 2
Control
Reload
CLKO
Reload
Table 15-3 demonstrates clock rates based on
instruction cycles and the BRG value loaded into
SSPxADD.
15.4.7.1
Because MSSP1 and MSSP2 are independent, they
can operate simultaneously in I
different baud rates. This is done by using different
BRG reload values for each module.
Because this mode derives its basic clock source from
the system clock, any changes to the clock will affect
both modules in the same proportion. It may be pos-
sible to change one or both baud rates back to a
previous value by changing the BRG reload value.
BRG Down Counter
2
SSPxADD<6:0>
C specification (which applies to rates greater than
BRG Value
0Ch
18h
1Fh
63h
09h
27h
02h
09h
00h
Baud Rate and Module
Interdependence
© 2008 Microchip Technology Inc.
F
OSC
(2 Rollovers of BRG)
/4
2
400 kHz
400 kHz
333 kHz
C Master mode at
312.5 kHz
1 MHz
100 kHz
308 kHz
100 kHz
100 kHz
F
SCL
(1)
(1)
(1)
(1)

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