C8051F930DK Silicon Laboratories Inc, C8051F930DK Datasheet - Page 42

• Manufacturer Part Number: C8051F930DK
• Description: KIT DEV C8051F920,F921,F930,F931
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051F930DK

• Contents: Target Board, Power Adapter, USB Debug Adapter, Cables, Batteries, and Software
• Processor To Be Evaluated: C8051F930
• Processor Series: C8051F9xx
• Data Bus Width: 8 bit
• Interface Type: I2C, UART, SPI
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 0.9 V to 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051F920, F921, F930, F931
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1473

C8051F93x-C8051F92x
42
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
the solder mask and the metal pad is to be 60 µm minimum, all the way around
the pad.
should be used to assure good solder paste release.
specification for Small Body Components.
Dimension
Figure 3.9. Typical LQFP-32 Landing Diagram
C1
C2
X1
Y1
E
Table 3.7. PCB Land Pattern
Rev. 1.1
8.40
8.40
0.40
1.25
MIN
0.80 BSC
MAX
8.50
8.50
0.50
1.35