mc68hc908kx8 Freescale Semiconductor, Inc, mc68hc908kx8 Datasheet - Page 192

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mc68hc908kx8

Manufacturer Part Number
mc68hc908kx8
Description
M68hc08 Microcontrollers
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Electrical Specifications
17.11 Memory Characteristics
192
RAM data retention voltage
FLASH program bus clock frequency
FLASH read bus clock frequency
FLASH page erase time
FLASH mass erase time
FLASH PGM/ERASE to HVEN setup time
FLASH high-voltage hold time
FLASH high-voltage hold time (mass erase)
FLASH program hold time
FLASH program time
FLASH return to read time
FLASH cumulative program HV period
FLASH endurance
FLASH data retention time
1. f
2. t
3. t
4. Typical endurance was evaluated for this product family. For additional information on how Freescale defines Typical En-
5. Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated
<1 K cycles
>1 K cycles
ing HVEN to 0.
t
durance, please refer to Engineering Bulletin EB619.
to 25°C using the Arrhenius equation. For additional information on how Freescale defines Typical Data Retention, please
refer to Engineering Bulletin EB618.
RCV
Read
HV
HV
is defined as the cumulative high voltage programming time to the same row before next erase.
must satisfy this condition: t
is defined as the time it needs before the FLASH can be read after turning off the high voltage charge pump, by clear-
is defined as the frequency range for which the FLASH memory can be read.
(4)
MC68HC908KX8 • MC68HC908KX2 • MC68HC08KX8 Data Sheet, Rev. 2.1
Characteristic
(5)
NVS
+ t
NVH
+ t
PGS
+ (t
PROG
x 64) ≤ t
Symbol
f
t
HV
t
Read
t
MErase
V
t
t
RCV
t
PROG
t
t
t
Erase
NVHL
HV
NVH
PGS
NVS
RDR
maximum.
(3)
(2)
(1)
10 k
Min
100
1.3
0.9
3.6
10
30
15
1
0
4
5
5
1
100 k
Typ
100
1
4
Freescale Semiconductor
Max
8 M
1.1
5.5
40
4
Cycles
Years
MHz
Unit
ms
ms
ms
Hz
µs
µs
µs
µs
µs
µs
V

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