TMP86C909XB Toshiba, TMP86C909XB Datasheet - Page 196

• Manufacturer Part Number: TMP86C909XB
• Description: EMULATION CHIP FOR TMP86F SDIP
• Manufacturer: Toshiba

Specifications of TMP86C909XB

• Accessory Type: Adapter
• For Use With/related Products: TMP86F SDIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

17.7 Recommended Oscillating Conditions
17.8 Handling Precaution
Note 1: To ensure stable oscillation, the resonator position, load capacitance, etc. must be appropriate. Because these factors are
Note 2: The product numbers and specifications of the resonators by Murata Manufacturing Co., Ltd. are subject to change. For
- The solderability test conditions for lead-free products (indicated by the suffix G in product name) are shown
-
below.
1. When using the Sn-37Pb solder bath
2. When using the Sn-3.0Ag-0.5Cu solder bath
When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we recommend elec-
trically shielding the package in order to maintain normal operating condition.
greatly affected by board patterns, please be sure to evaluate operation on the board on which the device will actually be
mounted.
up-to-date information, please refer to the following URL:
http://www.murata.com
Note:
Solder bath temperature = 230 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
Solder bath temperature = 245 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
The pass criteron of the above test is as follows:
C
(1) High-frequency Oscillation
1
XIN
Solderability rate until forming ≥ 95 %
XOUT
C
2
Page 185
C
(2) Low-frequency Oscillation
1
XTIN
XTOUT
C
2
TMP86F409NG