SSTUB32865ET/G,518 NXP Semiconductors, SSTUB32865ET/G,518 Datasheet - Page 26

• Manufacturer Part Number: SSTUB32865ET/G,518
• Description: IC REG BUFFER 28BIT 160TFBGA
• Manufacturer: NXP Semiconductors

Specifications of SSTUB32865ET/G,518

• Logic Type: 1:2 Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 2 V
• Number Of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Logic Family: SSTU
• Logical Function: Reg Bfr W/ParityTst
• Number Of Elements: 1
• Number Of Inputs: 28
• Number Of Outputs: 56
• High Level Output Current: -8mA
• Low Level Output Current: 8mA
• Propagation Delay Time: 3ns
• Operating Supply Voltage (typ): 1.8V
• Operating Supply Voltage (max): 2V
• Operating Supply Voltage (min): 1.7V
• Clock-edge Trigger Type: Posit/Negat-Edge
• Polarity: Non-Inverting
• Technology: CMOS
• Frequency (max): 450(Min)MHz
• Mounting: Surface Mount
• Pin Count: 160
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3542-2; 935281691518; SSTUB32865ET/G-T

NXP Semiconductors
14. Abbreviations
15. Revision history
Table 17.
SSTUB32865_3
Product data sheet
Document ID
SSTUB32865_3
Modifications:
SSTUB32865_2
SSTUB32865_1
Revision history
Release date
20070327
20060922
20060807
•
•
•
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 16.
Acronym
CMOS
DDR2
DIMM
DRAM
LVCMOS
RDIMM
SSTL
The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Table 10
Fig 23. Temperature profiles for large and small components
MSL: Moisture Sensitivity Level
temperature
“Characteristics”, I
Abbreviations
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Description
Complementary Metal Oxide Semiconductor
Double Data Rate 2
Dual In-line Memory Module
Dynamic Random Access Memory
Low Voltage Complementary Metal Oxide Semiconductor
Registered Dual In-line Memory Module
Stub Series Terminated Logic
Rev. 03 — 27 March 2007
= minimum soldering temperature
DD
(max) for static standby current changed from “100 A” to “2 mA”
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
1.8 V DDR2-800 registered buffer with parity
Change notice
-
-
-
SSTUB32865
temperature
Supersedes
SSTUB32865_2
SSTUB32865_1
-
peak
© NXP B.V. 2007. All rights reserved.
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time
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