CY7C1480V33_11 CYPRESS [Cypress Semiconductor], CY7C1480V33_11 Datasheet - Page 22

no-image

CY7C1480V33_11

Manufacturer Part Number
CY7C1480V33_11
Description
72-Mbit (2 M x 36/4 M x 18/1 M x 72) Pipelined Sync SRAM
Manufacturer
CYPRESS [Cypress Semiconductor]
Datasheet
Electrical Characteristics
Over the Operating Range
Capacitance
Thermal Resistance
Document Number: 38-05283 Rev. *K
Note
I
I
C
C
C
C
C
Parameter
15. Tested initially and after any design or process change that may affect these parameters.
SB3
SB4
Parameter
Parameter
ADDRESS
DATA
CTRL
CLK
I/O
JA
JC
Automatic CE
Power Down
Current—CMOS Inputs
Automatic CE
Power Down
Current—TTL Inputs
Address Input Capacitance
Data Input Capacitance
Control Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
[15]
Description
Description
Description
[13, 14]
[15]
(continued)
V
V
f = f
V
V
DD
IN
DD
IN
 0.3 V or V
MAX
 V
= Max, Device Deselected, or
= Max, Device Deselected,
T
V
Test conditions follow
standard test methods and
procedures for measuring
thermal impedance,
according to EIA/JESD51.
A
IH
DD
= 1/t
= 25 C, f = 1 MHz,
or V
= 3.3 V, V
Test Conditions
Test Conditions
CYC
IN
IN
 V
> V
IL
DDQ
, f = 0
DDQ
Test Conditions
= 2.5 V
– 0.3 V,
100-pin TQFP
100-pin TQFP
All speeds
4.0-ns cycle, 250 MHz
5.0-ns cycle, 200 MHz
6.0-ns cycle, 167 MHz
Package
24.63
Max
2.28
6
5
8
5
6
165-ball FBGA
165-ball FBGA
Package
Max
16.3
2.1
6
5
8
6
5
Min
CY7C1480V33
CY7C1482V33
CY7C1486V33
209-ball FBGA
209-ball FBGA
Package
Max
15.2
1.7
6
5
8
6
5
Max
245
245
245
135
Page 22 of 36
C/W
C/W
Unit
Unit
Unit
pF
pF
pF
pF
pF
mA
mA
mA
mA
[+] Feedback

Related parts for CY7C1480V33_11