CY7C1470BV33_11 CYPRESS [Cypress Semiconductor], CY7C1470BV33_11 Datasheet - Page 24

• Manufacturer Part Number: CY7C1470BV33_11
• Description: 72-Mbit (2 M x 36/4 M x 18/1 M x 72) Pipelined SRAM with NoBL Architecture
• Manufacturer: CYPRESS [Cypress Semiconductor]

Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
AC Test Loads and Waveforms
Document #: 001-15031 Rev. *H
C
C
C
C
C
Parameters
Parameter
ADDRESS
DATA
CTRL
CLK
IO
3.3 V IO Test Load
2.5 V IO Test Load
OUTPUT
OUTPUT


JA
JC
Address Input Capacitance
Data Input Capacitance
Control Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Z
Z
0
0
= 50 
= 50 
Description
Description
(a)
(a)
V
V
L
L
= 1.25 V
= 1.5 V
R
R
L
L
= 50 
= 50 
OUTPUT
OUTPUT
3.3 V
2.5 V
T
V
Test conditions follow
standard test methods and
procedures for measuring
thermal impedance, per
EIA/JESD51.
INCLUDING
INCLUDING
A
DD
= 25 C, f = 1 MHz,
JIG AND
JIG AND
SCOPE
SCOPE
Test Conditions
= 3.3 V, V
Test Conditions
5 pF
5 pF
DDQ
(b)
(b)
R = 317 
R = 1667 
= 2.5 V
R = 351 
R = 1538 
100-pin TQFP
100-pin TQFP
CY7C1472BV33, CY7C1474BV33
Package
V
24.63
2.28
Max
GND
GND
V
DDQ
6
5
8
6
5
DDQ
 1 ns
 1 ns
10%
10%
165-ball FBGA
165-ball FBGA
Package
ALL INPUT PULSES
ALL INPUT PULSES
Max
16.3
2.1
6
5
8
6
5
90%
90%
CY7C1470BV33
(c)
(c)
209-ball FBGA
209-ball FBGA
Package
Max
15.2
1.7
6
5
8
6
5
90%
90%
Page 24 of 33
10%
10%
 1 ns
 1 ns
C/W
C/W
Unit
Unit
pF
pF
pF
pF
pF
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