ep2sgx30c Altera Corporation, ep2sgx30c Datasheet - Page 139

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ep2sgx30c

Manufacturer Part Number
ep2sgx30c
Description
Stratix Ii Gx Device Data Sheet
Manufacturer
Altera Corporation
Datasheet

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Altera Corporation
October 2007
Note to
(1)
Series termination with
calibration
Differential termination
Table 2–34. On-Chip Termination Support by I/O Banks (Part 2 of 2)
On-Chip Termination Support
Clock pins CLK1 and CLK3, and pins FPLL[7..8]CLK do not support differential on-chip termination. Clock pins
CLK0 and CLK2, do support differential on-chip termination. Clock pins in the top and bottom banks (CLK[4..7,
12..15]) do not support differential on-chip termination.
Table
2–34:
f
(1)
Differential On-Chip Termination
Stratix II GX devices support internal differential termination with a
nominal resistance value of 100 for LVDS input receiver buffers. LVPECL
input signals (supported on clock pins only) require an external
termination resistor. Differential on-chip termination is supported across
the full range of supported differential data rates, as shown in the
High-Speed I/O Specifications section of the
chapter in volume 1 of the Stratix II GX Device Handbook.
For more information on differential on-chip termination, refer to the
High-Speed Differential I/O Interfaces with DPA in Stratix II & Stratix II GX
Devices
3.3-V LVTTL
3.3-V LVCMOS
2.5-V LVTTL
2.5-V LVCMOS
1.8-V LVTTL
1.8-V LVCMOS
1.5-V LVTTL
1.5-V LVCMOS
SSTL-2 class I and II
SSTL-18 class I and II
1.8-V HSTL class I
1.8-V HSTL class II
1.5-V HSTL class I
1.2-V HSTL
LVDS
HyperTransport technology
I/O Standard Support
chapter in volume 2 of the Stratix II GX Device Handbook.
Top and Bottom Banks
Stratix II GX Device Handbook, Volume 1
(3, 4, 7, 8)
v
v
v
v
v
v
v
v
v
v
v
v
v
v
DC & Switching Characteristics
Stratix II GX Architecture
Left Bank (1, 2)
v
v
2–131

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