MT90883 Zarlink Semiconductor, MT90883 Datasheet - Page 11

• Manufacturer Part Number: MT90883
• Description: (MT90880 - MT90883) TDM to Packet Processors
• Manufacturer: Zarlink Semiconductor

2.0
The device is contained in a 456-ball plastic ball grid array (456 PBGA) package:
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Package is viewed from the top side (e.g,. through top of the package). Note ball A1 is non-chamfered corner.
Body Size: 27 mm x 27 mm
Ball Count: 456
Ball Pitch: 1.0 mm
Ball Matrix: 26 x 26 (partially populated with a 6 x 6 GND matrix in the centre)
Ball Diameter 0.63 mm
Total Package Thickness 2.03 mm
Physical Specification
Figure 2 - Package View and Ball Positions
Zarlink Semiconductor Inc.
MT90880/1/2/3
11
Data Sheet