LPC3130 Philips Semiconductors (Acquired by NXP), LPC3130 Datasheet - Page 56

• Manufacturer Part Number: LPC3130
• Manufacturer: Philips Semiconductors (Acquired by NXP)

NXP Semiconductors
12. Package outline
Fig 24. LPC3130/3131 TFBGA180 package outline
LPC3130_3131_0
Preliminary data sheet
TFBGA180: thin fine-pitch ball grid array package; 180 balls
DIMENSIONS (mm are the original dimensions)
mm
UNIT
VERSION
SOT570-3
OUTLINE
max
nom
min
ball A1
index area
ball A1
index area
1.20
1.06
0.95
A
P
M
K
H
D
B
F
0.40
0.35
0.30
N
G
E
C
A
L
J
A
1
IEC
1
0.80
0.71
0.65
2
A
2
3
4
0.50
0.45
0.40
e
5
b
6
7
12.1
12.0
11.9
e
D
JEDEC
D
1
8
9
1/2 e
10
12.1
12.0
11.9
REFERENCES
E
Rev. 0.08 — 25 September 2008
0
11
12
b
0.8
13
e
14
10.4
JEITA
e
1
1/2 e
scale
B
e
5
∅ w
∅ v
10.4
e
e
A
E
2
2
M
M
C
C
0.15
v
A
B
A
10 mm
0.05
w
A
2
0.08
A
y
1
y
1
C
0.1
y
detail X
1
PROJECTION
EUROPEAN
LPC3130/3131
C
X
y
© NXP B.V. 2008. All rights reserved.
ISSUE DATE
08-05-30
08-07-09
SOT570-3
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