LPC3130 Philips Semiconductors (Acquired by NXP), LPC3130 Datasheet - Page 17

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LPC3130

Manufacturer Part Number
LPC3130
Description
Manufacturer
Philips Semiconductors (Acquired by NXP)
Datasheet

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NXP Semiconductors
LPC3130_3131_0
Preliminary data sheet
6.6 External Bus Interface (EBI)
6.7 Internal ROM Memory
6.8 Internal RAM memory
The EBI module acts as multiplexer with arbitration between the NAND flash and the
SDRAM/SRAM memory modules connected externally through the MPMC.
The main purpose for using the EBI module is to save external pins. However only data
and address pins are multiplexed. Control signals towards and from the external memory
devices are not multiplexed.
Table 7.
The internal ROM memory is used to store the boot code of the LPC3130/3131. After a
reset, the ARM processor will start its code execution from this memory.
The LPC3130/3131 ROM memory has the following features:
The ISRAM (Internal Static Memory Controller) module is used as controller between the
AHB bus and the internal RAM memory. The internal RAM memory can be used as
working memory for the ARM processor and as temporary storage to execute the code
that is loaded by boot ROM from external devices such as SPI-flash, NAND flash, and
SD/MMC cards.
Module
External SRAM0
External SRAM1
External SDRAM0 0x3000 0000
– extended wait
One chip select for synchronous memory and two chip selects for static memory
devices.
Power-saving modes.
Dynamic memory self-refresh mode supported.
Controller support for 2K, 4K, and 8K row address synchronous memory parts.
Support for all AHB burst types.
Little and big-endian support.
Support for the External Bus Interface (EBI) that enables the memory controller pads
to be shared.
Supports booting from SPI flash, NAND flash, SD/SDHC/MMC cards, UART, and
USB (DFU class) interfaces.
Supports option to perform CRC32 checking on the boot image.
Supports booting from managed NAND devices such as moviNAND, iNAND,
eMMC-NAND and eSD-NAND using SD/MMC boot mode.
Contains pre-defined MMU table (16 kB) for simple systems.
Memory map of the external SRAM/SDRAM memory modules
Maximum address space
0x2000 0000
0x2000 0000
0x2002 0000
0x2002 0000
Rev. 0.08 — 25 September 2008
0x2000 FFFF
0x2001 FFFF
0x2002 FFFF
0x2003 FFFF
0x33FF FFFF
Data width
8 bit
16 bit
8 bit
16 bit
16 bit
LPC3130/3131
© NXP B.V. 2008. All rights reserved.
64 kB
128 kB
64 kB
128 kB
64 MB
Device size
17 of 60

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