LPC3130 Philips Semiconductors (Acquired by NXP), LPC3130 Datasheet - Page 2

• Manufacturer Part Number: LPC3130
• Manufacturer: Philips Semiconductors (Acquired by NXP)

NXP Semiconductors
3. Ordering information
Table 1.
Table 2.
LPC3130_3131_0
Preliminary data sheet
Type number
LPC3130FET180
LPC3131FET180
Type number
LPC3130FET180
LPC3131FET180
Ordering information
Ordering options for LPC3130/3131
Package
Name
TFBGA180 Plastic thin fine pitch ball grid array package, 180 balls, body 12 x 12 x
TFBGA180 Plastic thin fine pitch ball grid array package, 180 balls, body 12 x 12 x
Core/bus
frequency
180 MHz/
90 MHz
180 MHz/
90 MHz
System functions
Operating voltage and temperature
TFBGA180 package: 12 x 12 mm
Integrated 4/8/16-bit 6800/8080 compatible LCD interface
Dynamic clock gating and scaling
Multiple power domains
Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB
DMA controller
Four 32-bit timers
Watchdog timer
PWM module
Random Number Generator (RNG)
General Purpose I/O pins (GPIO)
Flexible and versatile interrupt structure
JTAG interface with boundary scan and ARM debug access
Core voltage: 1.2 V
I/O voltage: 1.8 V, 2.8 V, 3.3 V
Temperature: −40 °C to +85 °C
Description
0.8 mm
0.8 mm
Total
SRAM
96 kB
192 kB
Rev. 0.08 — 25 September 2008
High-speed
USB
Device/
Host/OTG
Device/
Host/OTG
2
, 0.8 mm pitch
10-bit
ADC
channels
4
4
I
I
-bus
2 each
2 each
2
2
S/
C
LPC3130/3131
MCI SDHC/
SDIO/
CE_ATA
yes
yes
© NXP B.V. 2008. All rights reserved.
Temperature
range
−40 °C to +85 °C
−40 °C to +85 °C
Version
SOT570-3
SOT570-3
2 of 60