SAM3SD8B Atmel Corporation, SAM3SD8B Datasheet - Page 1125

• Manufacturer Part Number: SAM3SD8B
• Manufacturer: Atmel Corporation

41.1
41.2
1125
1125
Soldering Profile
Packaging Resources
SAM3S8/SD8
SAM3S8/SD8
Table 41-16
Table 41-16. Soldering Profile
Note:
A maximum of three reflow passes is allowed per component.
Land Pattern Definition.
Refer to the following IPC Standards:
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5° C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25° C to Peak Temperature
• IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern
• Atmel Green and RoHS Policy and Package Material Declaration Data Sheet
Standards)
http://www.atmel.com/green/
The package is certified to be backward compatible with Pb/Sn soldering profile.
gives the recommended soldering profile from J-STD-020C.
http://landpatterns.ipc.org/default.asp
Green Package
3° C/sec. max.
180 sec. max.
60 sec. to 150 sec.
20 sec. to 40 sec.
260° C
6° C/sec. max.
8 min. max.
11090A–ATARM–10-Feb-12
11090A–ATARM–10-Feb-12