NOIL1SN3000A-GDC ON Semiconductor, NOIL1SN3000A-GDC Datasheet - Page 51

• Manufacturer Part Number: NOIL1SN3000A-GDC
• Manufacturer: ON Semiconductor

Specifications of NOIL1SN3000A-GDC

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Mechanical Specifications
Table 52. MECHANICAL SPECIFICATIONS
Die (Referenced to
Pin 1 being bottom left
in Figure 39 on page 52)
Glass lid specification
Mechanical shock
Vibration
Mounting profile
Recommended socket
manufacturer
Die thickness
Die center, X offset to the center of package
Die center, Y offset to the center of the package
Die position, X tilt
Die position, Y tilt
Die placement accuracy in package
Die rotation accuracy
Optical center referenced from the package center.
Optical center referenced from the package center.
Distance from PCB plane to top of the die surface
Distance from top of the die surface to top of the glass lid
X x Y size
Thickness
Spectral range for optical coating of window
Reflection coefficient for window
JESD22-B104C; Condition G
JESD22-B103B; Condition 1
Lead-free wave soldering profile for pin grid array package if no socket is used
Andon Electronics (http://www.andonelectronics.com)
Mechanical Specifications
http://onsemi.com
51
BGA socket: 10-21-06-369-414T4-R27-L14
Thru hole: 10-21-06-369-400T4-R27-L14
Min
–50
400
–1
–1
–1
20
–
–
–
–
–
–
–
–
–
–
–
28.2 x 19.5
–230
1450
2000
Typ
750
0
0
0
0
0
0
2
2
1
–
–
–
2000
1100
Max
<0.8
50
–
–
–
1
1
1
–
–
–
–
–
–
–
Units
deg
deg
deg
mm
mm
mm
mm
mm
mm
mm
um
mm
mm
nm
Hz
%
G