LPC1850FET256,551 NXP Semiconductors, LPC1850FET256,551 Datasheet - Page 56
![MCU 32BIT ARM CORTEX M3 256BGA](/photos/27/78/277808/lbga156_sml.jpg)
LPC1850FET256,551
Manufacturer Part Number
LPC1850FET256,551
Description
MCU 32BIT ARM CORTEX M3 256BGA
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheet
1.LPC1830FET256551.pdf
(87 pages)
Specifications of LPC1850FET256,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD/MMC, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
-
Program Memory Type
ROMless
Eeprom Size
-
Ram Size
200K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Processor Series
LPC1850
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
200 KB
Interface Type
SPI Flash (SPIFI), USB, Ethernet, LCD, External Memory Controller, I2C
Maximum Clock Frequency
150 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Temperature Range
- 40 C to + 85 C
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-6682
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1850FET256,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC1850FET256,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
Table 8.
T
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] V
[11] 3-state outputs go into 3-state mode in Deep power-down mode.
[12] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[13] To V
LPC1850_30_20_10
Objective data sheet
Symbol
Oscillator pins
V
V
USB pins
V
V
amb
i(XTAL1)
o(XTAL2)
IC
i(dif)
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
The RTC typically fails when V
V
Conditions <tbd>.
On pin VBAT; I
On pin VBAT; V
All internal pull-ups disabled. All pins configured as output and driven LOW. V
V
Including voltage on outputs in 3-state mode.
=
DD(REG)(3V3)
DDA(3V3)
DD(3V3)
40
SS
.
Static characteristics
supply voltages must be present.
C to +85
= 3.3 V; T
= 3.3 V; T
DD(REG)(3V3)
Parameter
input voltage on pin
XTAL1
output voltage on pin
XTAL2
common-mode input
voltage
differential input voltage
BAT
= 3.3 V; T
amb
C, unless otherwise specified.
amb
= 25 C.
= <tbd> nA; V
= 25 C for all power consumption measurements.
amb
VBAT
= 25 C.
…continued
drops below 1.6 V.
DD(REG)(3V3)
All information provided in this document is subject to legal disclaimers.
Conditions
high-speed mode
full-speed/low-speed
mode
chirp mode
Rev. 1.2 — 17 February 2011
= 3.3 V; V
BAT
< V
DD(REG)(3V3)
DD(3V3)
; T
amb
32-bit ARM Cortex-M3 microcontroller
Min
0.5
0.5
<tbd>
<tbd>
<tbd>
<tbd>
= 3.3 V; T
LPC1850/30/20/10
= 25 C.
amb
= 25 C.
Typ
-
-
<tbd>
-
-
<tbd>
[1]
© NXP B.V. 2011. All rights reserved.
Max
1.2
1.2
<tbd>
<tbd>
<tbd>
<tbd>
56 of 87
Unit
V
V
mV
mV
mV
mV