LPC1850FET256,551 NXP Semiconductors, LPC1850FET256,551 Datasheet - Page 4
![MCU 32BIT ARM CORTEX M3 256BGA](/photos/27/78/277808/lbga156_sml.jpg)
LPC1850FET256,551
Manufacturer Part Number
LPC1850FET256,551
Description
MCU 32BIT ARM CORTEX M3 256BGA
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheet
1.LPC1830FET256551.pdf
(87 pages)
Specifications of LPC1850FET256,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD/MMC, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
-
Program Memory Type
ROMless
Eeprom Size
-
Ram Size
200K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Processor Series
LPC1850
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
200 KB
Interface Type
SPI Flash (SPIFI), USB, Ethernet, LCD, External Memory Controller, I2C
Maximum Clock Frequency
150 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Temperature Range
- 40 C to + 85 C
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-6682
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1850FET256,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC1850FET256,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
4. Ordering information
Table 1.
Table 2.
LPC1850_30_20_10
Objective data sheet
Type number
LPC1850FET256
LPC1850
LPC1850
LPC1830FET256
LPC1830
LPC1830
LPC1820
LPC1820FET100
LPC1810
LPC1810FET100
Type number
LPC1850
LPC1850
LPC1850
LPC1830
LPC1830
LPC1830
LPC1820
LPC1820
LPC1810
LPC1810
Ordering information
Ordering options
4.1 Ordering options
SRAM
200 kB
200 kB
200 kB
200 kB
200 kB
200 kB
168 kB
168 kB
136 kB
136 kB
Package
Name
LBGA256
LQFP208
BGA180
LBGA256
LQFP208
BGA180
LQFP144
BGA100
LQFP144
BGA100
Description
plastic low profile ball grid array package; 256 balls; body 17 17 1 mm
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plastic low profile ball grid array package; 256 balls; body 17 17 1 mm
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LCD
yes
yes
yes
no
no
no
no
no
no
no
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 17 February 2011
Ethernet
yes
yes
yes
yes
yes
yes
no
no
no
no
USB0 (Host,
Device, OTG)
yes
yes
yes
yes
yes
yes
yes
yes
no
no
32-bit ARM Cortex-M3 microcontroller
LPC1850/30/20/10
USB1 (Host,
Device)
yes
yes
yes
yes
yes
yes
no
no
no
no
© NXP B.V. 2011. All rights reserved.
LQFP208
LQFP144
Package
LBGA256
LQFP208
BGA180
LBGA256
BGA180
BGA100
BGA100
LQFP144
Version
sot740-2
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sot740-2
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