LPC1850FET256,551 NXP Semiconductors, LPC1850FET256,551 Datasheet - Page 53

• Manufacturer Part Number: LPC1850FET256,551
• Description: MCU 32BIT ARM CORTEX M3 256BGA
• Manufacturer: NXP Semiconductors
• Series: LPC18xxr

Specifications of LPC1850FET256,551

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD/MMC, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: -
• Program Memory Type: ROMless
• Eeprom Size: -
• Ram Size: 200K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-LBGA
• Processor Series: LPC1850
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 200 KB
• Interface Type: SPI Flash (SPIFI), USB, Ethernet, LCD, External Memory Controller, I2C
• Maximum Clock Frequency: 150 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 6
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 85 C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-6682

NXP Semiconductors
9. Thermal characteristics
Table 7.
V
LPC1850_30_20_10
Objective data sheet
Symbol
T
DD
j(max)
= 2.2 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
•
•
•
j

=
T
R
P
40
amb
D
T
th(j-a)
amb

= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)

P
D
All information provided in this document is subject to legal disclaimers.

Conditions

C unless otherwise specified;
R
th j a
Rev. 1.2 — 17 February 2011

–


j
(C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
LPC1850/30/20/10
DD
Typ
-
. The I/O power dissipation of
Max
<tbd>
© NXP B.V. 2011. All rights reserved.
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