LPC1850FET256,551 NXP Semiconductors, LPC1850FET256,551 Datasheet - Page 40

• Manufacturer Part Number: LPC1850FET256,551
• Description: MCU 32BIT ARM CORTEX M3 256BGA
• Manufacturer: NXP Semiconductors
• Series: LPC18xxr

Specifications of LPC1850FET256,551

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD/MMC, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: -
• Program Memory Type: ROMless
• Eeprom Size: -
• Ram Size: 200K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-LBGA
• Processor Series: LPC1850
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 200 KB
• Interface Type: SPI Flash (SPIFI), USB, Ethernet, LCD, External Memory Controller, I2C
• Maximum Clock Frequency: 150 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 6
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 85 C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-6682

NXP Semiconductors
LPC1850_30_20_10
Objective data sheet
7.12.3.1 Features
7.12.5.1 Features
7.12.4 SD/MMC card interface
7.12.5 External Memory Controller (EMC)
commands and command formats. SPIFI provides sufficient flexibility to be compatible
with common flash devices and includes extensions to help insure compatibility with future
devices.
The SD/MMC card interface supports the following modes to control:
The LPC1850/30/20/10 EMC is a Memory Controller peripheral offering support for
asynchronous static memory devices such as RAM, ROM, and NOR flash. In addition, it
can be used as an interface with off-chip memory-mapped devices and peripherals.
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Interfaces to serial flash memory in the main memory map.
Supports classic and 4-bit bidirectional serial protocols.
Half-duplex protocol compatible with various vendors and devices.
Data rates of up to 40 MB per second total.
Supports DMA access.
Secure Digital memory (SD version 3.0)
Secure Digital I/O (SDIO version 2.0)
Consumer Electronics Advanced Transport Architecture (CE-ATA version 1.1)
Multimedia Cards (MMC version 4.4)
Dynamic memory interface support including single data rate SDRAM.
Asynchronous static memory device support including RAM, ROM, and NOR flash,
with or without asynchronous page mode.
Low transaction latency.
Read and write buffers to reduce latency and to improve performance.
8/16/32 data and 24 address lines wide static memory support. On parts LPC1820/10
only 8/16 data lines are available.
16 bit and 32 bit wide chip select SDRAM memory support.
Static memory features include:
– Asynchronous page mode read
– Programmable Wait States
– Bus turnaround delay
– Output enable and write enable delays
– Extended wait
Four chip selects for synchronous memory and four chip selects for static memory
devices.
Power-saving modes dynamically control CKE and CLKOUT to SDRAMs.
Dynamic memory self-refresh mode controlled by software.
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 17 February 2011
32-bit ARM Cortex-M3 microcontroller
LPC1850/30/20/10
© NXP B.V. 2011. All rights reserved.
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