MC9S08AW60CFGE Freescale, MC9S08AW60CFGE Datasheet - Page 6

MC9S08AW60CFGE

Manufacturer Part Number
MC9S08AW60CFGE
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S08AW60CFGE

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
2KB
# I/os (max)
34
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
60KB
Lead Free Status / RoHS Status
Compliant

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Part Number:
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Part Number:
MC9S08AW60CFGER
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Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web will be
the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
The following revision history table summarizes changes contained in this document. For your
convenience, the page number designators have been linked to the appropriate location.
6
This product incorporates SuperFlash
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
Revision
Number
http://freescale.com/
0
1
2
3
4
5
6
7
8
11/20/2009
Revision
12/2007
12/2007
2/2008
3/2008
5/2008
6/2008
7/2008
5/2009
Date
Initial Release.
Updated the package designators for the 32 LQFP and 44 LQFP to be LC and LD
respectively.
Corrected the SPI block module to be V3.
AC market launch.Verified that the ADC Temp Sensor values were correct.
Incorporated general release edits and updates, revised the Stop2 and Stop3 max
values, added the RoHS logo, and updated the back cover addresses.
Corrected the note in the TPM introduction.
Changed all instances of S9S08AWxxA to MC9S08AWxxA except in Appendix B.
Added 42SDIP package option.
Corrected SPI registers in
Corrected title of
Added errata for the following sections:
Updated the whole document for MC9S08AW16A/MC9S08AW8A to support the third TPM
module.
Updated the TPM 1 channel to 4 for the 32-pin packages in the
Updated the bit 2 of IRQSC register in the
Updated the Temp Sensor Voltage in the
• Throughout (remove stop1 instances)
Table 4-1
Table 4-2
Section 9.2, “Keyboard Pin
Section 9.3, “Features
Table A-6
Table A-7
Figure A-12
®
technology licensed from SST.
MC9S08AC16 Series Data Sheet, Rev. 8
Table
6-3,
Table
Figure
Sharing”
Description of Changes
4-2. Added V
6-13,
Figure
Table
Table
BG
A-9.
6-14,
4-2.
in
Table
Table 6-5
A-6.
and
Table
Figure
Freescale Semiconductor
1-1.
6-19.

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