MC9S08AW60CFGE Freescale, MC9S08AW60CFGE Datasheet - Page 127

• Manufacturer Part Number: MC9S08AW60CFGE
• Manufacturer: Freescale

Specifications of MC9S08AW60CFGE

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 34
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 60KB
• Lead Free Status / RoHS Status: Compliant

Chapter 8
Internal Clock Generator (S08ICGV4)
The internal clock generation (ICG) module is used to generate the system clocks for the MC9S08AC16
Series MCU. The analog supply lines V
V
and Timing
Freescale Semiconductor
SS
pins. Electrical parametric data for the ICG may be found in
ICG
Specifications.”
ICGERCLK
FFE
* ICGLCLK is the alternate BDC clock source for the MC9S08AC16 Series.
* XCLK is the fixed-frequency clock.
ICGLCLK*
ICGOUT
Freescale Semiconductor recommends that FLASH location 0xFFBE be
reserved to store a nonvolatile version of ICGTRM. This will allow
debugger and programmer vendors to perform a manual trim operation and
store the resultant ICGTRM value for users to access at a later time.
CPU
÷
CONTROL
SYSTEM
2
LOGIC
÷
2
XCLK*
Figure 8-1. System Clock Distribution Diagram
COP
BUSCLK
MC9S08AC16 Series Data Sheet, Rev. 8
1 kHz
RTI
DDA
BDC
and V
TPM1
NOTE
TPMCLK
SSA
TPM3
TPM2
are internally derived from the MCU’s V
IIC1
ADC has min and max
frequency requirements.
See the Electricals appendix
and the ADC chapter.
Appendix A, “Electrical Characteristics
ADC1
SCI1
SCI2
RAM
FLASH has frequency
requirements for program
and erase operation.
See the Electricals
appendix.
FLASH
SPI1
DD
and
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