MB9BF104RPMC-GE1 Fujitsu Semiconductor America Inc, MB9BF104RPMC-GE1 Datasheet - Page 96

• Manufacturer Part Number: MB9BF104RPMC-GE1
• Description: IC MCU 32BIT 256KB FLASH 120LQFP
• Manufacturer: Fujitsu Semiconductor America Inc
• Series: FM3 MB9B100r

Specifications of MB9BF104RPMC-GE1

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CSIO, EBI/EMI, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 100
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 120-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: 865-1117

(Continued)
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
96
MB9B100 Series
C
112-ball plastic PFBGA
2003-2010 FUJITSU SEMICONDUCTOR LIMITED B112004S-c-2-3
10.00±0.10
(BGA-112P-M04)
(.394±.004)
0.20(.008)
112-ball plastic PFBGA
(INDEX AREA)
10.00±0.10(.394±.004)
(BGA-112P-M04)
S
A
0.10(.004) S
(.014±.004)
(Stand off)
0.35±0.10
0.20(.008) S B
(.049±.008)
(Seated height)
1.25±0.20
S
Package width ×
Mounting height
Sealing method
package length
0.80(.031)
Lead shape
REF
A
Ball pitch
Ball size
Weight
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
(112-Ф0.18±.004)
112-Ф0.45±010
L
K
J
H
B
G
10.00 × 10.00 mm
Ф0.08(.003)
F
DS706-00007-1v0-E
1.45 mm Max.
Soldering ball
Plastic mold
E D C B A
Ф 0.45 mm
0.80 mm
0.22 g
M
0.80(.031)
S
REF
INDEX
A
B
10
11
4
9
8
7
6
5
3
2
1