MB9BF104RPMC-GE1 Fujitsu Semiconductor America Inc, MB9BF104RPMC-GE1 Datasheet - Page 94

• Manufacturer Part Number: MB9BF104RPMC-GE1
• Description: IC MCU 32BIT 256KB FLASH 120LQFP
• Manufacturer: Fujitsu Semiconductor America Inc
• Series: FM3 MB9B100r

Specifications of MB9BF104RPMC-GE1

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CSIO, EBI/EMI, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 100
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 120-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: 865-1117

(Continued)
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
94
MB9B100 Series
C
100-pin plastic LQFP
2009-2010 FUJITSU SEMICONDUCTOR LIMITED F100034S-c-3-4
100
76
(FPT-100P-M23)
75
1
INDEX
0.50(.020)
*
16.00±0.20(.630 ±.008)S Q
14.00±0.10(.551 ±.004)S Q
100-pin plastic LQFP
(FPT-100P-M23)
(.009±.002)
0.22±0.05
51
25
0.08(.003)
50
26
M
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
0.145±0.055
(.006±.002)
"A"
Package width ×
Mounting height
Sealing method
package length
0.08(.003)
Lead shape
Lead bend
Lead pitch
direction
Weight
Details of "A" pa r t
(Mounting height)
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
(
1.50
.059 -.004
(.020±.008)
(.024±.006)
0.50±0.20
0.60±0.15
0°~8°
+.008
+0.20
- 0.10
)
14.00 mm × 14.00 mm
DS706-00007-1v0-E
1.70 mm MAX
Normal bend
Plastic mold
0.25(.010)
0.50 mm
Gullwing
(.004±.004)
(Stand off)
0.65 g
0.10±0.10