MB9BF104RPMC-GE1 Fujitsu Semiconductor America Inc, MB9BF104RPMC-GE1 Datasheet - Page 45

• Manufacturer Part Number: MB9BF104RPMC-GE1
• Description: IC MCU 32BIT 256KB FLASH 120LQFP
• Manufacturer: Fujitsu Semiconductor America Inc
• Series: FM3 MB9B100r

Specifications of MB9BF104RPMC-GE1

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CSIO, EBI/EMI, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 100
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 120-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: 865-1117

DS706-00007-1v0-E
 Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance
during soldering, you should only mount under FUJITSU's recommended conditions. For detailed
information about mount conditions, contact your FUJITSU sales representative.
・ Lead Insertion Type
・ Surface Mount Type
・ Lead-Free Packaging
・ Storage of Semiconductor Devices
・ Baking
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods:
direct soldering on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the
board and using the flow soldering (wave soldering) method of applying liquid solder.
In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the
absolute ratings for storage temperature. Mounting processes should conform to FUJITSU
recommended mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces
can lead to contact deterioration after long periods. For this reason it is recommended that the surface
treatment of socket contacts and IC leads be verified before mounting.
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads
are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch
results in increased susceptibility to open connections caused by deformed pins, or shorting due to
solder bridges.
You must use appropriate mounting techniques. FUJITSU recommends the solder reflow method, and
has established a ranking of mounting conditions for each product. Users are advised to mount packages
in accordance with FUJITSU ranking of recommended conditions.
Because plastic chip packages are formed from plastic resins, exposure to natural environmental
conditions will cause absorption of moisture. During mounting, the application of heat to a package that
has absorbed moisture can cause surfaces to peel, reducing moisture resistance and causing packages to
crack. To prevent, do the following:
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the
FUJITSU recommended conditions for baking.
Condition:+125 C/24 h
Note:
・ Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product.
・ Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at
・ When necessary, FUJITSU packages semiconductor devices in highly moisture-resistant aluminum
・ Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
Store products in locations where temperature changes are slight.
temperatures between 5 C and 30 C When you open Dry Package that recommends humidity 40%
to 70% relative humidity.
laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags
for storage.
When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic
soldering, junction strength may be reduced under some conditions of use.
MB9B100 Series
45