MB9BF104RPMC-GE1 Fujitsu Semiconductor America Inc, MB9BF104RPMC-GE1 Datasheet - Page 93

• Manufacturer Part Number: MB9BF104RPMC-GE1
• Description: IC MCU 32BIT 256KB FLASH 120LQFP
• Manufacturer: Fujitsu Semiconductor America Inc
• Series: FM3 MB9B100r

Specifications of MB9BF104RPMC-GE1

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CSIO, EBI/EMI, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 100
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 120-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: 865-1117

 PACKAGE DIMENSIONS
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
DS706-00007-1v0-E
C
2005 -2010 FUJITSU SEMICONDUCTOR LIMITED F100031S-c-3-5
100
76
100-pin plastic LQFP
(FPT-100P-M20)
75
1
INDEX
0.50(.020)
*14.00±0.10(.551±.004)SQ
16.00±0.20(.630±.008)SQ
100-pin plastic LQFP
(FPT-100P-M20)
(.008 ±.002)
0.20 ±0.05
51
25
0.08(.003)
50
26
M
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
0.145±0.055
"A"
Package width ×
(.006 ±.002)
Sealing method
package length
Mounting height
Lead shape
(Reference)
Lead pitch
0.08(.003)
Weight
Code
MB9B100 Series
Dimensions in mm (inches).
Note: The values in parentheses are reference values
1.50
Details of "A" part
(Mounting height)
+0.20
–0.10
0.50 ±0.20
(.020 ±.008)
(.024 ±.006)
0°~8°
0.60 ±0.15
.059
P-LFQFP100-14×14-0.50
+.008
–.004
14.0 mm × 14.0 mm
1.70 mm Max
Plastic mold
0.50 mm
Gullwing
0.65 g
0.25(.010)
(.004 ±.004)
(Stand off)
0.10 ±0.10
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