MB9BF104RPMC-GE1 Fujitsu Semiconductor America Inc, MB9BF104RPMC-GE1 Datasheet - Page 46

• Manufacturer Part Number: MB9BF104RPMC-GE1
• Description: IC MCU 32BIT 256KB FLASH 120LQFP
• Manufacturer: Fujitsu Semiconductor America Inc
• Series: FM3 MB9B100r

Specifications of MB9BF104RPMC-GE1

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CSIO, EBI/EMI, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 100
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 120-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: 865-1117

46
MB9B100 Series
・ Static Electricity
・ Precautions for Use Environment
Please check the latest handling precautions at the following URL.
http://edevice.fujitsu.com/fj/handling-e.pdf
Because semiconductor devices are particularly susceptible to damage by static electricity, you must
take the following precautions:
Reliability of semiconductor devices depends on ambient temperature and other conditions as described
above.
For reliable performance, do the following:
Customers considering the use of FUJITSU products in other special environmental conditions should
consult with FUJITSU sales representatives.
・ Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus
・ Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
・ Eliminate static body electricity by the use of rings or bracelets connected to ground through high
・ Ground all fixtures and instruments, or protect with anti-static measures.
・ Avoid the use of styrofoam or other highly static-prone materials for storage of completed board
1. Humidity
2. Discharge of Static Electricity
3. Corrosive Gases, Dust, or Oil
4. Radiation, Including Cosmic Radiation
5. Smoke, Flame
Note:
Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If
high humidity levels are anticipated, consider anti-humidity processing.
When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal
operation.
In such cases, use anti-static measures or processing to prevent discharges.
Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will
adversely affect the device. If you use devices in such conditions, consider ways to prevent such
exposure or to protect the devices.
Most devices are not designed for environments involving exposure to radiation or cosmic radiation.
Users should provide shielding as appropriate.
for ion generation may be needed to remove electricity.
resistance (on the level of 1 M). Wearing of conductive clothing and shoes, use of conductive
floor mats and other measures to minimize shock loads is recommended.
assemblies.
Plastic molded devices are flammable, and therefore should not be used near combustible
substances.
If devices begin to smoke or burn, there is danger of the release of toxic gases.
DS706-00007-1v0-E