MB9BF104RPMC-GE1 Fujitsu Semiconductor America Inc, MB9BF104RPMC-GE1 Datasheet - Page 95

• Manufacturer Part Number: MB9BF104RPMC-GE1
• Description: IC MCU 32BIT 256KB FLASH 120LQFP
• Manufacturer: Fujitsu Semiconductor America Inc
• Series: FM3 MB9B100r

Specifications of MB9BF104RPMC-GE1

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CSIO, EBI/EMI, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 100
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 120-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: 865-1117

(Continued)
Please check the latest package dimension at the following URL.
http://edevice.fujitsu.com/package/en-search/
DS706-00007-1v0-E
C
2002-2010 FUJITSU SEMICONDUCTOR LIMITED F120033S-c-4-7
120-pin plastic LQFP
LEAD No.
(FPT-120P-M21)
120
91
90
1
120-pin plastic LQFP
INDEX
(FPT-120P-M21)
18.00±0.20(.709±.008)SQ
*
16.00
0.50(.020)
+0.40
–0.10
.630
+.016
–.004
(.009±.002)
0.22±0.05
SQ
61
30
0.08(.003)
60
31
M
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
"A"
Package width ×
Sealing method
0.145
package length
Mounting height
.006
Resin protrusion is +0.25(.010) MAX(each side).
Lead shape
(Reference)
Lead pitch
0.08(.003)
+0.05
–0.03
+.002
–.001
Weight
Code
MB9B100 Series
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
Details of "A" part
(.024±.006)
0.60±0.15
0~8°
1.50
.059
P-LFQFP120-16×16-0.50
+0.20
–0.10
+.008
–.004
(Mounting height)
16.0 × 16.0 mm
1.70 mm MAX
Plastic mold
0.50 mm
Gullwing
0.88 g
0.25(.010)
(.004±.002)
(Stand off)
0.10±0.05
95