FSBB15CH60C Fairchild Semiconductor, FSBB15CH60C Datasheet - Page 7

• Manufacturer Part Number: FSBB15CH60C
• Description: IC POWER MOD SPM 600V SPM27CC
• Manufacturer: Fairchild Semiconductor
• Series: SPM™r
• Type: IGBTr

Specifications of FSBB15CH60C

• Configuration: 3 Phase
• Current: 15A
• Voltage: 600V
• Voltage - Isolation: 2500Vrms
• Package / Case: SPM27CC
• Transistor Polarity: N Channel
• Dc Collector Current: 15A
• Collector Emitter Voltage Vces: 2V
• Power Dissipation Pd: 55W
• Collector Emitter Voltage V(br)ceo: 600V
• Operating Temperature Range: -40°C To
• Operating Temperature (max): 150C
• Operating Temperature (min): -40C
• Pin Count: 27
• Mounting: Through Hole
• Case Length: 44mm
• Case Height: 5.5mm
• Screening Level: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

level shift latch logic using high voltage LDMOS that passes signals from upper side gate and lower side
gate. Consequently, it was designed with sufficient immunity against such possible malfunctions as latch-on,
latch-up, and latch-off caused by IGBT switching noise and system outside noise. Fairchild’s Mini DIP SPM
design has also taken into consideration the possibility of high side malfunction caused by short PWM pulse.
Since the low voltage part and the high voltage part are configured onto the same silicon in the HVIC, it
cannot operate normally when the electric potential in the high voltage part becomes lower than the ground
of the low voltage part. Accordingly, sufficient margin was given to take into consideration the negative
voltage level that could cause such abnormal operation. Soft turn-off function was added to secure basic
IGBT SOA (Safe Operating Area) under short circuit conditions.
1.4 Advantage of Mini DIP SPM-driven inverter drives
outline. Figure 1.2 shows the junction to case thermal resistance at each current range of the Mini DIP SPM.
As seen in the figure, in the 15A, 20A and 30A range, intelligent 3-phase IGBT module with high power
density (Size vs. Power) was implemented. Accordingly, in the low power range, inverter system designers
are able to cover almost the entire range of 0.1KW~3KW rating in a single power circuit design using Mini
DIP SPM. Since circuitry and tools can become more standardized, product development and testing
process are simplified, significantly reducing development time and cost. Through control board
standardization, overall manufacturing cost will be substantially reduced as users are able to simplify
materials purchasing and maintain manufacturing consistency.
2008-03-03
SPM Inverter Engine Platform
HVIC is sensitive to noise since it is not a complete galvanic isolation structure but is implemented as a
Mini DIP SPM was designed to have 3A~30A rated current of products built into a single package
Lead
Lead
Frame
IC
IC
Al
Al
Wire
Wire
Figure 1.1 Cross Sections of Mini DIP SPM
DBC
IGBT FRD
IGBT FRD
V4 Mini DIP SPM Application Note (2008-03-03)
Epoxy Molding Compound
7
FAIRCHILD SEMICONDUCTOR - Smart Power Module
Full pack
Full pack