FSBB15CH60C Fairchild Semiconductor, FSBB15CH60C Datasheet - Page 27

IC POWER MOD SPM 600V SPM27CC

FSBB15CH60C

Manufacturer Part Number
FSBB15CH60C
Description
IC POWER MOD SPM 600V SPM27CC
Manufacturer
Fairchild Semiconductor
Series
SPM™r
Type
IGBTr
Datasheets

Specifications of FSBB15CH60C

Configuration
3 Phase
Current
15A
Voltage
600V
Voltage - Isolation
2500Vrms
Package / Case
SPM27CC
Transistor Polarity
N Channel
Dc Collector Current
15A
Collector Emitter Voltage Vces
2V
Power Dissipation Pd
55W
Collector Emitter Voltage V(br)ceo
600V
Operating Temperature Range
-40°C To
Operating Temperature (max)
150C
Operating Temperature (min)
-40C
Pin Count
27
Mounting
Through Hole
Case Length
44mm
Case Height
5.5mm
Screening Level
Automotive
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FSBB15CH60C
Manufacturer:
CYPRESS
Quantity:
5 610
Part Number:
FSBB15CH60C
Manufacturer:
FSC/ON可看货
Quantity:
20 000
Part Number:
FSBB15CH60C
0
Company:
Part Number:
FSBB15CH60C
Quantity:
1 700
9. Each capacitor should be mounted as close to the pins of the Mini DIP SPM as possible.
10. To prevent surge destruction, the wiring between the filter capacitor and the P & Ground pins should be
11. Relays are used in almost all home appliances electrical equipment. These relays should be kept a
12. Excessively large inductance due to long wiring patterns between the shunt resistor and Mini DIP SPM
13. Opto-coupler can be used for electric (galvanic) isolation. When opto-couplers are used, attention should
2008-03-03
as short as possible. The use of a high frequency non-inductive capacitor of around 0.1~0.22μF between
the P & Ground pins is recommended. In addition to reducing local voltage spikes, the placement and
quality of this capacitor will have a direct impact on both conducted and radiated EMI.
sufficient distance from the CPU to prevent electromagnetic radiation from impacting the CPU.
will cause large surge voltage that might damage the Mini DIP SPM’s internal ICs. Therefore, the wiring
between the shunt resistor and Mini DIP SPM should be as short as possible. Additionally, C
(more than 1μF) should be mounted as close to the pins of the Mini DIP SPM as possible.
be taken to the signal logic level and opto-coupler delay time. Also, since the V
capability is 1mA (max), it cannot drive an opto-coupler directly. A buffer circuit should be added in the
primary side of the opto-coupler.
V4 Mini DIP SPM Application Note (2008-03-03)
27
FAIRCHILD SEMICONDUCTOR - Smart Power Module
FO
output current
SPC15

Related parts for FSBB15CH60C