FSBB15CH60C Fairchild Semiconductor, FSBB15CH60C Datasheet - Page 56

• Manufacturer Part Number: FSBB15CH60C
• Description: IC POWER MOD SPM 600V SPM27CC
• Manufacturer: Fairchild Semiconductor
• Series: SPM™r
• Type: IGBTr

Specifications of FSBB15CH60C

• Configuration: 3 Phase
• Current: 15A
• Voltage: 600V
• Voltage - Isolation: 2500Vrms
• Package / Case: SPM27CC
• Transistor Polarity: N Channel
• Dc Collector Current: 15A
• Collector Emitter Voltage Vces: 2V
• Power Dissipation Pd: 55W
• Collector Emitter Voltage V(br)ceo: 600V
• Operating Temperature Range: -40°C To
• Operating Temperature (max): 150C
• Operating Temperature (min): -40C
• Pin Count: 27
• Mounting: Through Hole
• Case Length: 44mm
• Case Height: 5.5mm
• Screening Level: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10. Package
10.1 Heat Sink Mounting
device stress, when mounting an SPM on a heat sink.
2008-03-03
Heat Sink
Silicon Grease
Screw Tightening Torque
Heatsink Flatness
Mounting Torque
DBC Flatness
The following precautions should be observed to maximize the effect of the heat sink and minimize
Please follow the instructions of the manufacturer, when attaching a heat sink to an Mini DIP SPM. Be
careful not to apply excessive force to the device when attaching the heat sink.
Drill holes for screws in the heat sink exactly as specified. Smooth the surface by removing burrs and
protrusions of indentations. Refer to Table 10.1.
Heat-sink-equipped devices can become very hot when in operation. Do not touch, as you may sustain
a burn injury.
Apply silicon grease between the SPM and the heat sink to reduce the contact thermal resistance. Be
sure to apply the coating thinly and evenly, do not use too much. A uniform layer of silicon grease (100
~ 200um thickness) should be applied in this situation.
Do not exceed the specified fastening torque. Over tightening the screws may cause package cracks
and bolts and AL heat-fin destruction. Tightening the screws beyond a certain torque can cause
saturation of the contact thermal resistance. The tightening torques in table 10.1 is recommended for
obtaining the proper contact thermal resistance and avoiding the application of excessive stress to the
device.
Avoid stress due to tightening on one side only. Figure 10.1 shows the recommended torque order for
mounting screws. Uneven mounting can cause the SPM DBC substrate to be damaged.
Weight
Item
Mounting Screw : M3
Table 10.1 Torque Rating
(Note Fig. 10.1)
Condition
V4 Mini DIP SPM Application Note (2008-03-03)
Recommended
56
FAIRCHILD SEMICONDUCTOR - Smart Power Module
0.62 N⋅m
-100
Min.
0.51
0
-
Limits
15.40
0.62
Typ
-
+120
1.00
Max
+50
-
Unit
N⋅m
μm
μm
g