FSBB15CH60C Fairchild Semiconductor, FSBB15CH60C Datasheet - Page 53

• Manufacturer Part Number: FSBB15CH60C
• Description: IC POWER MOD SPM 600V SPM27CC
• Manufacturer: Fairchild Semiconductor
• Series: SPM™r
• Type: IGBTr

Specifications of FSBB15CH60C

• Configuration: 3 Phase
• Current: 15A
• Voltage: 600V
• Voltage - Isolation: 2500Vrms
• Package / Case: SPM27CC
• Transistor Polarity: N Channel
• Dc Collector Current: 15A
• Collector Emitter Voltage Vces: 2V
• Power Dissipation Pd: 55W
• Collector Emitter Voltage V(br)ceo: 600V
• Operating Temperature Range: -40°C To
• Operating Temperature (max): 150C
• Operating Temperature (min): -40C
• Pin Count: 27
• Mounting: Through Hole
• Case Length: 44mm
• Case Height: 5.5mm
• Screening Level: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

resistance. From Fig. 9.11, we can see that the increase in the length to 150%, that is 79.5mm (53mm × 1.5),
reduces the resistance to 85% ( ≅ 2.3 ° C/W), and an increase of 200% (53mm × 2=106mm) reduces the
resistance to 78% ( ≅ 2.09 ° C/W). Figure 9.12 is the result of the variation in the base-plate width and it shows
that the increase in the width to 150% (78mm × 1.5=117mm) and 200% (78mm × 2=156mm) reduces the
resistance to 79% ( ≅ 2.144 ° C/W) and 70% ( ≅ 1.88 ° C/W), respectively. Therefore, increasing the width is
more effective reducing the thermal resistance, as compared with increasing the length.
2008-03-03
Figures 9.11 and 9.12 show the results to see the effect of the base-plate length and width on thermal
Figure 9.13 shows the thermal resistance variation with a change in the fin height.
Figure 9.11 R
2.9
2.9
2.7
2.7
2.5
2.5
2.3
2.3
2.1
2.1
1.9
1.9
1.7
1.7
1.5
1.5
(Content: a=1.5mm, b=5.45mm, c=21mm, e=4mm, f=78mm)
3.6
3.6
3.2
3.2
2.8
2.8
2.4
2.4
2.0
2.0
(Constant: c=21mm, d=53mm, e=4mm, f=78mm, g=53mm)
Figure 9.10 R
3
3
50
50
Fin & Base plate length, d, g (mm)
Fin & Base plate length, d, g (mm)
θ
ha
70
70
θ
variation by change of the base-plate length.
ha
4
4
variation by change of the fin spacing.
90
90
Fin to Fin Spacing, b(mm)
Fin to Fin Spacing, b(mm)
V4 Mini DIP SPM Application Note (2008-03-03)
a: 0.5mm
a: 0.5mm
a: 1.5mm
a: 1.5mm
Fin Thickness
Fin Thickness
5
5
53
110
110
FAIRCHILD SEMICONDUCTOR - Smart Power Module
6
6
130
130
a: 1.0mm
a: 1.0mm
a: 2.0mm
a: 2.0mm
150
150
7
7
170
170
8
8