D17760BP200ADV Renesas Electronics America, D17760BP200ADV Datasheet - Page 417

MPU 3V 8K,PB-FREE, 256-BGA

D17760BP200ADV

Manufacturer Part Number
D17760BP200ADV
Description
MPU 3V 8K,PB-FREE, 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of D17760BP200ADV

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
69
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D17760BP200ADV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
CKIO
Precharge-sel
CSn
RD/WR
RAS
CASS
DQMn
BS
CKE
DACKn
(SA: IO → memory)
Bank
Address
D31–D0
(write)
Note:
The (Tnop) cycle is inserted only for SA-DMA. The DACKn signal is output as indicated by the solid line.
In the case of a normal write, the (Tnop) cycle is deleted and the DACKn signal is output as indicated by the dotted line.
For DACKn, an example is shown where CHCRn.AL (acknowledge level) = 0 for the DMAC.
Tnop
Figure 10.24 Burst Write Timing (Same Row Address)
(Tnop)
Tc1
c1
c1
H/L
Tc2
↓ Single address DMA
↑ Normal write
c2
Tc3
c3
Tc4
c4
Tc5
c5
c5
H/L
Tc6
Rev. 2.00 Feb. 12, 2010 Page 333 of 1330
c6
Tc7
c7
Tc8
c8
Trw1
Trw1
REJ09B0554-0200

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