D17760BP200ADV Renesas Electronics America, D17760BP200ADV Datasheet - Page 1338

MPU 3V 8K,PB-FREE, 256-BGA

D17760BP200ADV

Manufacturer Part Number
D17760BP200ADV
Description
MPU 3V 8K,PB-FREE, 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of D17760BP200ADV

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
69
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D17760BP200ADV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Rev. 2.00 Feb. 12, 2010 Page 1254 of 1330
REJ09B0554-0200
(write)
DACKn
(SA: IO
CKIO
Bank
Precharge-sel
Address
CSn
RD/WR
RAS
CASS
DQMn
BS
CKE
NOTES:
D31-D0
memory)
IO
SA
DA
DACK set to active-high
: Dack device
: Single address DMA transfer
: Dual address DMA transfer
Figure 33.31 Synchronous DRAM Auto-Precharge Write Bus Cycle: Burst
t
t
t
t
t
Tr
AD
CSD
CASD2
DACD
RASD
Row
Row
Row
(RCD[1:0] = 01, TPC[2:0] = 001, TRWL[2:0] = 010)
Trw
t
RASD
t
WDD
t
CASD2
t
t
t
Tc1
t
RWD
BSD
DQMD
AD
H/L
c1
c1
t
CASD2
t
t
Tc2
t
RWD
BSD
WDD
c2
Tc3
c3
Tc4
c4
Tc5
t
AD
H/L
c5
c5
Tc6
c6
Tc7
t
DACD
c7
Tc8
c8
t
DQMD
Trw1
t
t
AD
CSD
Trw1
Tpc

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