HD64F3067RF20 Renesas Electronics America, HD64F3067RF20 Datasheet - Page 346

IC H8 MCU FLASH 128K 100-QFP

HD64F3067RF20

Manufacturer Part Number
HD64F3067RF20
Description
IC H8 MCU FLASH 128K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3067RF20

Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Package
100PQFP
Family Name
H8
Maximum Speed
20 MHz
Operating Supply Voltage
5 V
Data Bus Width
16|32 Bit
Number Of Programmable I/os
70
Interface Type
SCI
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Number Of Timers
7
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3067RF20
Manufacturer:
HIT
Quantity:
610
Part Number:
HD64F3067RF20
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD64F3067RF20
Manufacturer:
HITACHI/日立
Quantity:
20 000
Part Number:
HD64F3067RF20V
Manufacturer:
RENESAS
Quantity:
1 000
Section 8 I/O Ports
Pin
PB
TMIO
DREQ
PB
TMO
Rev. 4.00 Jan 26, 2006 page 322 of 938
REJ09B0276-0400
3
2
/TP
/TP
2
3
/CS
/
1
11
/CS
10
/
/
5
4
Pin Functions and Selection Method
The DRAM interface settings by bits DRAS2 to DRAS0 in DRCRA, bits OIS3/2 and OS1/0 in TCSR3, bits
CCLR1 and CCLR0 in TCR3, bit CS4E in CSCR, bit NDER11 in NDERB, and bit PB
function as follows.
DRAM interface
settings
OIS3/2 and OS1/0
CS4E
PB
NDER11
Pin function
Notes:
DRAM interface
settings
DRAS2
DRAS1
DRAS0
The DRAM interface settings by bits DRAS2 to DRAS0 in DRCRA, bits OIS3/2 and OS1/0 in TCSR2, bit
CS5E in CSCR, bit NDER10 in NDERB, and bit PB
DRAM interface
settings
OIS3/2 and OS1/0
CS5E
PB
NDER10
Pin function
Note: *
DRAM interface
settings
DRAS2
DRAS1
DRAS0
3
2
DDR
DDR
CS
1.
2.
3.
5
is output as RAS
TMIO
When an external request is specified as a DMAC activation source, DREQ
bits OIS3 and OIS2, OS1 and OS0, CCLR1 and CCLR0, CS4E, NDER11, and PB
CS
4
is output as RAS
3
input when CCLR1 = CCLR0 = 1.
input
0
input
0
PB
PB
0
0
5
.
3
2
0
0
4
.
1
1
output
output
PB
PB
(1)
0
1
0
0
0
1
0
0
3
2
(1)
0
0
All 0
All 0
2
(1) in table below
(1) in table below
DDR select the pin function as follows.
1
1
output
output
TP
TP
1
1
1
1
DREQ
TMIO
11
10
1
1
3
1
input *
input *
output
output
0
0
CS
CS
1
1
2
1
4
5
0
0
(2)
(2)
TMIO
TMIO
1
1
3
DDR select the pin
Not all 0
Not all 0
3
2
1
1
output
output
1
input regardless of
0
0
3
DDR.
(2) in table
(2) in table
(1)
1
1
output *
output*
below
below
CS
CS
(1)
1
4
1
5
3

Related parts for HD64F3067RF20