DF2367VF33V Renesas Electronics America, DF2367VF33V Datasheet - Page 39

• Manufacturer Part Number: DF2367VF33V
• Description: IC H8S/2367 MCU FLASH 128QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• For Use With: YR0K42378FC000BA - KIT EVAL FOR H8S/2378HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

23.3 φ Clock Output Control..................................................................................................... 836
23.4 Usage Notes ...................................................................................................................... 837
Section 24 List of Registers
24.1 Register Addresses (Address Order) ................................................................................. 840
24.2 Register Bits...................................................................................................................... 850
24.3 Register States in Each Operating Mode........................................................................... 863
Section 25 Electrical Characteristics
25.1 Electrical Characteristics of Masked ROM and ROMless Versions ................................. 873
25.2 Electrical Characteristics of 0.35 μm F-ZTAT Version.................................................... 911
25.3 Electrical Characteristics for 0.18 μm F-ZTAT Version................................................... 926
25.4 Usage Note........................................................................................................................ 940
23.2.2 Sleep Mode .......................................................................................................... 830
23.2.3 Software Standby Mode....................................................................................... 831
23.2.4 Hardware Standby Mode ..................................................................................... 834
23.2.5 Module Stop Mode .............................................................................................. 835
23.2.6 All-Module-Clocks-Stop Mode ........................................................................... 836
23.4.1 I/O Port Status...................................................................................................... 837
23.4.2 Current Dissipation during Oscillation Stabilization Standby Period .................. 837
23.4.3 DMAC/DTC Module Stop................................................................................... 837
23.4.4 On-Chip Peripheral Module Interrupts ................................................................ 837
23.4.5 Writing to MSTPCR, EXMSTPCR ..................................................................... 837
23.4.6 Notes on Clock Division Mode............................................................................ 838
25.1.1 Absolute Maximum Ratings ................................................................................ 873
25.1.2 DC Characteristics ............................................................................................... 874
25.1.3 AC Characteristics ............................................................................................... 877
25.1.4 A/D Conversion Characteristics........................................................................... 910
25.1.5 D/A Conversion Characteristics........................................................................... 910
25.2.1 Absolute Maximum Ratings ................................................................................ 911
25.2.2 DC Characteristics ............................................................................................... 912
25.2.3 A/D Conversion Characteristics........................................................................... 923
25.2.4 D/A Conversion Characteristics........................................................................... 923
25.2.5 Flash Memory Characteristics.............................................................................. 924
25.3.1 Absolute Maximum Ratings ................................................................................ 926
25.3.2 DC Characteristics ............................................................................................... 927
25.3.3 AC Characteristics ............................................................................................... 930
25.3.4 A/D Conversion Characteristics........................................................................... 938
25.3.5 D/A Conversion Characteristics........................................................................... 938
25.3.6 Flash Memory Characteristics.............................................................................. 939
.............................................................................................. 839
.............................................................................. 873
Rev.6.00 Mar. 18, 2009 Page xxxvii of lviii
REJ09B0050-0600