R5F61663RN50FPV Renesas Electronics America, R5F61663RN50FPV Datasheet - Page 1402

MCU FLASH 384K ROM 144-LQFP

R5F61663RN50FPV

Manufacturer Part Number
R5F61663RN50FPV
Description
MCU FLASH 384K ROM 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Datasheets

Specifications of R5F61663RN50FPV

Core Processor
H8SX
Core Size
16/32-Bit
Speed
50MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
92
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R5F61663RN50FPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 30 Electrical Characteristics
Note:
Rev. 2.00 Sep. 24, 2008 Page 1368 of 1468
REJ09B0412-0200
Item
External clock output delay settling
time
External clock input low pulse width
External clock input high pulse width
External clock rising time
External clock falling time
Subclock oscillation settling time
Subclock oscillator oscillation
frequency
Subclock cycle time
*
Oscillator
NMI
NMIEG
SSBY
V
Figure 30.3 Oscillation Settling Timing after Software Standby Mode
CC
= PLLV
CC
NMI exception
handling
NMIEG = 1
SSBY = 1
= DrV
Figure 30.2 External Bus Clock Timing
CC
SLEEP
instruction
= 2.95 V to 3.60 V in the H8SX/1668M Group.
Symbol
t
t
t
t
t
t
f
t
DEXT
EXL
EXH
EXr
EXf
OSC3
SUB
SUB
Software standby mode
(power-down mode)
t
CH
t
cyc
Min.
1
27.7
27.7
2
32.768
30.5
t
Cf
t
CL
t
Cr
settling time
Oscillation
Max.
5
5
32.768
30.5
t
OSC2
NMI exception handling
Unit.
ms
ns
ns
ns
ns
s
kHz
µs
Test Conditions
Figure 30.4
Figure 30.5

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