HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 732

IC H8S MCU FLASH 128K 100-TQFP

HD64F2218TF24

Manufacturer Part Number
HD64F2218TF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of HD64F2218TF24

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Rev.7.00 Dec. 24, 2008 Page 676 of 698
REJ09B0074-0700
Item
SCI
A/D
converter
Boundary
scan
Input
clock
cycle
Input clock pulse
width
Input clock rise time
Input clock fall time
Transmit data delay
time
Receive data setup
time (synchronous)
Receive data hold
time (synchronous)
Trigger input setup
time
TCK cycle time
TCK high level pulse
width
TCK low level pulse
width
TRST pulse width
TRST setup time
TDI setup time
TDI hold time
TMS setup time
TMS hold time
TDO delay time
Asynchro-
nous
Synchro-
nous
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Symbol Min. Max. Min. Max. Min. Max. Unit
t
Scyc
SCKW
SCKr
SCKf
TXD
RXS
RXH
TRGS
Tcyc
TCKH
TCKL
TRSW
TRSS
TDIS
TDIH
TMSS
TMSH
TDOD
4
6
0.4
150
150
60
166.6 —
0.4
0.4
20
350
80
10
80
10
Condition A Condition B Condition
0.6
1.5
1.5
150
0.6
0.6
100
4
6
0.4
60
60
40
62.5 —
0.4
0.4
20
250
30
10
30
10
0.6
1.5
1.5
60
0.6
0.6
40
4
6
0.4
40
40
30
41.6 —
0.4
0.4
20
250
20
10
20
10
C,D
0.6
1.5
1.5
40
0.6
0.6
35
t
t
t
ns
ns
ns
t
t
t
ns
ns
cyc
Scyc
cyc
Tcyc
Tcyc
Tcyc
Test
Conditions
Figure
22.15
Figure
22.16
Figure
22.17
Figure
22.18
Figure
22.19
Figure
22.20

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