HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 725

IC H8S MCU FLASH 128K 100-TQFP

HD64F2218TF24

Manufacturer Part Number
HD64F2218TF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of HD64F2218TF24

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Item
Read data access
time 3
Read data access
time 4
Read data access
time 5
WR delay time 1
WR delay time 2
WR pulse width 1
WR pulse width 2
Write data delay time t
Write data setup time t
Write data hold time
WAIT setup time
WAIT hold time
BREQ setup time
BACK delay time
Bus-floating time
Symbol Min.
t
t
t
t
t
t
t
t
t
t
t
t
t
ACC3
ACC4
ACC5
WRD1
WRD2
WSW1
WSW2
WDD
WDS
WDH
WTS
WTH
BRQS
BACD
BZD
1.0 × t
– 60
1.5 × t
– 60
0.5 × t
– 80
0.5 × t
– 60
90
10
90
Condition A
cyc
cyc
cyc
cyc
Max.
2.0 × t
– 90
2.5 × t
– 90
3.0 × t
– 90
90
90
100
90
160
cyc
cyc
cyc
Min.
1.0 × t
– 30
1.5 × t
– 30
0.5 × t
– 30
0.5 × t
– 15
50
10
50
Condition B Condition C, D
cyc
cyc
cyc
cyc
Max.
2.0 × t
– 65
2.5 × t
– 65
3.0 × t
– 65
50
50
50
50
80
Rev.7.00 Dec. 24, 2008 Page 669 of 698
cyc
cyc
cyc
Min.
1.0 × t
– 20
1.5 × t
– 20
0.5 × t
– 20
0.5 × t
– 10
25
5
25
cyc
cyc
cyc
cyc
Max.
2.0 × t
– 40
2.5 × t
– 35
3.0 × t
– 40
20
25
30
35
50
cyc
cyc
cyc
Unit Conditions
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
REJ09B0074-0700
Test
Figures 22.7,
22.10
Figure 22.8
Figure 22.8
Figures 22.7,
22.8
Figure 22.7
Figure 22.8
Figures 22.7,
22.8
Figure 22.8
Figures 22.7,
22.8
Figure 22.9
Figure 22.11

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