HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 201

IC H8S MCU FLASH 128K 100-TQFP

HD64F2218TF24

Manufacturer Part Number
HD64F2218TF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of HD64F2218TF24

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Section 6 Bus Controller
6.6.4
Wait Control
When accessing external space, this LSI can extend the bus cycle by inserting one or more wait
states (Tw). There are two ways of inserting wait states: program wait insertion and pin wait
insertion using the WAIT pin.
Program Wait Insertion: From 0 to 3 wait states can be inserted automatically between the T
2
state and T
state on an individual area basis in 3-state access space, according to the settings of
3
WCRH and WCRL.
Pin Wait Insertion: Setting the WAITE bit in BCRH to 1 enables wait insertion by means of the
WAIT pin in the H8S/2218 Group. When external space is accessed in this state, program wait
insertion is first carried out according to the settings in WCRH and WCRL. Then, if the WAIT pin
state is inserted. If the WAIT pin is
is low at the falling edge of φ in the last T
or T
state, a T
2
W
W
held low, T
states are inserted until it goes high.
W
Rev.7.00 Dec. 24, 2008 Page 145 of 698
REJ09B0074-0700

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