HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 646

• Manufacturer Part Number: HD64F2218TF24
• Description: IC H8S MCU FLASH 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2218TF24

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: SCI, SmartCard, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: 3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Rev.7.00 Dec. 24, 2008 Page 590 of 698
REJ09B0074-0700
V
FWE
MD2 to MD0*
RES
SWE1 bit
φ
Notes:
CC
Period during which flash memory access is prohibited
(x: Wait time after setting SWE1 bit)*
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
1.
2.
3.
Figure 17.17 Power-On/Off Timing (User Program Mode)
Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
power-off by pulling the pins up or down.
See section 22.7, Flash Memory Characteristics.
Mode programming setup time t
1
t
OSC1
t
MDS
SWE1 set
*
Wait time:
3
MDS
2
(min) = 200 ns.
x
Programming/
erasing
possible
Wait time:
SWE1 cleared
θ
min 0 μs