HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 659

IC H8S MCU FLASH 128K 100-TQFP

HD64F2218TF24

Manufacturer Part Number
HD64F2218TF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of HD64F2218TF24

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
19.6
19.6.1
supply a clock to the subclock divider, connect a 32.768-kHz crystal resonator, as shown in figure
19.6. Figure 19.7 shows the equivalence circuit for a 32.768-kHz oscillator.
19.6.2
If no subclock is required, connect the OSC1 pin to Vss and leave OSC2 open, as shown in figure
19.8. Set the SUBSTP bit of LPWRCR to 1. If this setting is not made, transition to power-down
mode may not complete properly in some cases.
Subclock Oscillator
Connecting 32.768-kHz Crystal Resonator
Handling Pins when Subclock Not Required
OSC1
Figure 19.6 Example Connection of 32.768-kHz Quartz Oscillator
Figure 19.7 Equivalence Circuit for 32.768-kHz Oscillator
Figure 19.8 Pin Handling when Subclock Not Required
Note: C
OSC1
OSC2
Ls
capacitance of the board.
1
and C
OSC1
OSC2
Cs
2
are reference values including the floating
Co
C
C
1
2
Rs
C
Co = 1.5 pF (typ.)
Rs = 14 kΩ (typ.)
fw = 32.768 kHz
Type name = C001R (SEIKO EPSON)
1
Rev.7.00 Dec. 24, 2008 Page 603 of 698
= C
Open state
2
= 15 pF (typ.)
OSC2
REJ09B0074-0700

Related parts for HD64F2218TF24