HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 649

• Manufacturer Part Number: HD64F2218TF24
• Description: IC H8S MCU FLASH 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2218TF24

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: SCI, SmartCard, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: 3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

This LSI incorporates a masked ROM which has the following features.
18.1
• Size
Product Class
H8S/2218 Group
H8S/2212 Group
• Connected to the bus master through 16-bit data bus, enabling one-state access to both byte
Figure 18.1 shows a block diagram of the on-chip masked ROM.
data and word data.
Features
Figure 18.1 Block Diagram of On-Chip Masked ROM (64 kbytes)
HD6432217
HD6432211
HD6432210, HD6432210S
Section 18 Masked ROM
H'00FFFE
H'000000
H'000002
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
ROM Size
64 kbytes
64 kbytes
32 kbytes
H'00FFFF
H'000001
H'000003
Rev.7.00 Dec. 24, 2008 Page 593 of 698
ROM Address (Modes 6 and 7)
H'000000 to H'00FFFF
H'000000 to H'00FFFF
H'000000 to H'007FFF
REJ09B0074-0700